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Dive into the research topics where Seung Hyun Sohn is active.

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Featured researches published by Seung Hyun Sohn.


Journal of Applied Physics | 2007

Effect of thickness on electrical properties of bismuth-magnesium niobate pyrochlore thin films deposited at low temperature

Cheng-Ji Xian; Jong-Hyun Park; Soon-Gil Yoon; Jin Seok Moon; Sung Taek Lim; Seung Hyun Sohn; Hyung Mi Jung; Yee-na Shin; Woon Chun Kim; Mk Jeon; Seong-Ihl Woo

Bi2Mg2∕3Nb4∕3O7 (BMN) pyrochlore thin films were deposited at 25 and 100°C on Cu∕Ti∕Si substrates by pulsed laser deposition. Dielectric and leakage current properties of BMN films are investigated as a function of film thickness. The critical thicknesses showing the thickness dependence of dielectric constant are approximately 50 and 70nm in BMN films deposited at 25 and 100°C, respectively. The capacitances of interfacial layers in the films deposited at 25 and 100°C are approximately 5.5 and 3.9pF, respectively. The thickness dependence of leakage current characteristics was attributed to the copper diffusion into the BMN films. An intrinsic conduction of BMN films was controlled by Schottky emission and the barrier height was estimated as 0.9–1.2eV in the temperature range from 25to100°C. Film thickness in terms of leakage current characteristics is limited above 100nm for embedded capacitor applications.


Archive | 2006

Method of fabricating printed circuit board having embedded multi-layer passive devices

Seung Hyun Sohn; Yul Kyo Chung; Hyun Ju Jin; Eun Tae Park


Archive | 2006

PRINTED CIRCUIT BOARD MATERIAL FOR EMBEDDED PASSIVE DEVICES AND PREPARING METHOD THEREOF

Seung Hyun Sohn; Hyo Soon Shin


Archive | 2012

Piezoelectric device of polymer

Woon Chun Kim; Kwang Joe Jeon; Seung Hyun Sohn; Kang Heon Hur; Hyun Ho Lim


Archive | 2007

Capacitor and multi-layer board embedding the capacitor

Seung Hyun Sohn; Yul Kyo Chung; Seung Eun Lee; Yee Na Shin


Archive | 2008

Capacitor embedded printed circuit board and manufacturing method thereof

Seung Hyun Sohn; Yul Kyo Chung; Sung Taek Lim; Hyung Mi Jung


Archive | 2006

Composite dielectric composition having small variation of capacitance with temperature and signal-matching embedded capacitor prepared using the same

Eun Tae Park; Yul Kyo Chung; Seung Hyun Sohn; Min Ji Ko


Archive | 2008

PCB having electronic components embedded therein and method of manufacturing the same

Seung Hyun Sohn; Yul Kyo Chung; Byoung Chan Kim; Moon Il Kim; Kwan Kyu Kim; Yee Na Shin


Archive | 2006

Printed circuit board with film capacitor embedded therein and method for manufacturing the same

Jin Seok Moon; Seung Eun Lee; Hyung Mi Jung; Yul Kyo Chung; Seung Hyun Sohn


Archive | 2006

Method of manufacturing printed circuit board with built-in multilayer capacitor

Yul Kyo Chung; Hyun Ju Jin; Eun Tae Park; Seung Hyun Sohn; ジョン・ユルギョ; ジン・ヒョンジュ; ソン・スンヒョン; パク・ウンテ

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Hyung Mi Jung

Samsung Electro-Mechanics

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Jin Seok Moon

Samsung Electro-Mechanics

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Seung Eun Lee

Samsung Electro-Mechanics

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Hyo Soon Shin

Samsung Electro-Mechanics

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Yee Na Shin

Samsung Electro-Mechanics

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Eun Tae Park

Samsung Electro-Mechanics

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Woon Chun Kim

Samsung Electro-Mechanics

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Byoung Chan Kim

Samsung Electro-Mechanics

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Hyun Ho Lim

Samsung Electro-Mechanics

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