Shutao Wen

Redistribution of iron during directional solidification of metallurgical-grade silicon at low growth rate

Redistribution of iron during directional solidification of metallurgical-grade silicon (MG-Si) was conducted at low growth rate. Concentrations of iron were examined by ICP-MS and figured in solid and liquid phases, at grain boundary and in growth direction. Concentrations are significantly different between solid and liquid phases. The thickness of the solute boundary layer is about 4 mm verified by mass balance law, and the effective distribution coefficient is 2.98×10−4. Iron element easily segregates at grain boundary at low growth rate. In growth direction, concentrations are almost constant until 86% ingot height, and they do not meet the Scheil equation completely, which is caused by the low growth rate. The effect of convection on the redistribution of iron was discussed in detail. Especially, the “dead zone” of convection plays an important role in the iron redistribution.

Effect of electron beam injection on boron redistribution in silicon and oxide layer

Abstract The behavior of boron redistribution in silicon with and without oxide layer after electron beam injection (EBI) was investigated. Special defect shapes were generated on the surface of bare and oxidized silicon wafers. Secondary ion mass spectrometer was used to measure the boron profile. The results showed that after long EBI time, boron tended to be induced from both sides of the transition region between the oxide layer and silicon. For the sample without oxide layer after EBI, boron tended to diffuse towards the surface and its concentration obviously reduced inside the silicon. The results of the study show the potential use of the process in removing boron impurity in silicon.