Silvia Kronmueller

Microelectromechanical systems, and methods for encapsualting and fabricating same

Microelectromechanical systems having trench isolated contacts, and methods for fabricating same

Method of fabricating microelectromechanical systems and devices having trench isolated contacts

Micromechanical component and corresponding method for its manufacture

Microelectromechanical systems and devices having thin film encapsulated mechanical structures

Electromechanical system having a controlled atmosphere, and method of fabricating same

Anchors for microelectromechanical systems having an soi substrate, and method of fabricating same

Crack and residue free conformal deposited silicon oxide with predictable and uniform etching characteristics

Microelectromechanical device including an encapsulation layer of which a portion is removed to expose a substantially planar surface having a portion that is disposed outside and above a chamber and including a field region on which integrated circuits are formed, and methods for fabricating same

Method for producing a capping wafer for a sensor