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Featured researches published by Soichi Katagiri.


Applied Optics | 1991

Position sensing of a grating mark by heterodyne detection using a Zeeman laser

Keiji Kataoka; Soichi Katagiri; Toshiei Kurosaki

A way to detect with high resolution the position of a wafer and a mask is proposed and evaluated. In this method, a grating mark on a wafer or a mask is detected by heterodyne interference using a He-Ne Zeeman laser. Experiments show that the position of a wafer or a mask could be detected with a resolution of approximately 0.01 microm.


Archive | 1991

X-ray pattern masking by a reflective reduction projection optical system

Tsuneo Terasawa; Masaaki Itou; Shigeo Moriyama; Soichi Katagiri; Hiroshi Fukuda


Archive | 1998

Polishing method for semiconductors and apparatus therefor

Soichi Katagiri; Shigeo Moriyama; Kan Yasui; Katsuhiko Yamaguchi


Archive | 1993

Methods for measuring optical system, and method and apparatus for exposure using said measuring method

Eiichi Seya; Massaaki Ito; Soichi Katagiri; Tsuneo Terasawa; Minoru Hidaka; Eiji Takeda; Norio Saitou


Archive | 1992

Method of forming patterns and apparatus for carrying out the same

Tsuneo Terasawa; Katsunobu Hama; Soichi Katagiri


Archive | 1992

Workpiece having alignment marks for positioning a pattern at a different pitch to be formed thereon, and method for fabricating the same

Soichi Katagiri; Shigeo Moriyama; Tsuneo Terasawa; Masaaki Itou


Archive | 1991

Method of position detection and the method and apparatus of printing patterns by use of the position detection method

Soichi Katagiri; Shigeo Moriyama; Tsuneo Terasawa; Masaaki Itou


Archive | 1988

Optical projection printing apparatus wherein wafer mark has a grating pitch in the sagittal plane of the first optical system

Keiji Kataoka; Toshiei Kurosaki; Seiji Yonezawa; Soichi Katagiri


Archive | 1991

Method and apparatus for measuring minute displacement by subject light diffracted and reflected from a grating to heterodyne interference

Yasuhiro Yoshitake; Yoshitada Oshida; Soichi Katagiri; Shuji Sugiyama; Yoshimitsu Saze


Archive | 2002

Method for manufacturing a semiconductor device that includes planarizing with a grindstone that contains fixed abrasives

Soichi Katagiri; Ui Yamaguchi; Seiichi Kondo; Kan Yasui; Masahiro Kaise; Minoru Honda

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