Wen-chou Vincent Wang

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Featured researches published by Wen-chou Vincent Wang.

Archive | 1999

Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making

Tetsuzo Yoshimura; Yashuhito Takahashi; Masaaki Inao; Michael G. Lee; William T. Chou; Solomon I. Beilin; Wen-chou Vincent Wang; James Roman; Thomas J. Massingill

Archive | 2001

Single and multilayer waveguides and fabrication process

Tetsuzo Yoshimura; Yasuhito Takahashi; James Roman; Solomon I. Beilin; Wen-chou Vincent Wang; Masaaki Inao

Archive | 2001

Optical coupling structures and the fabrication processes

Tetsuzo Yoshimura; Yasuhito Takahashi; James Roman; Mark Thomas McCormack; Solomon I. Beilin; Wen-chou Vincent Wang; Masaaki Inao

Archive | 2001

Optical reflective structures and method for making

Tetsuzo Yoshimura; Yashuhito Takahashi; Kiyoshi Kuwabara; Solomon I. Beilin; Michael G. Peters; Wen-chou Vincent Wang; Masaaki Inao

Archive | 1998

Chip and board stress relief interposer

Michael Guang-Tzong Lee; Solomon I. Beilin; Wen-chou Vincent Wang

Archive | 1995

Controlled impedence interposer substrate

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang; Larry L. Moresco; Teruo Murase

Archive | 2000

Reduced stress and zero stress interposers for integrated-circuit chips, multichip substrates, and the like

Wen-chou Vincent Wang; Michael G. Lee; Solomon I. Beilin

Archive | 1999

Multi-layer opto-electronic substrates with electrical and optical interconnections and methods for making

Tetsuzo Yoshimura; Yashuhito Takahashi; Masaaki Inao; Michael G. Lee; William T. Chou; Solomon I. Beilin; Wen-chou Vincent Wang; James Roman; Thomas J. Massingill

Archive | 1999

Reduced cross-talk noise high density signal interposer with power and ground wrap

Michael G. Peters; Wen-chou Vincent Wang; Yasuhito Takahashi; William T. Chou; Michael G. Lee; Solomon I. Beilin

Archive | 2000

Three-dimensional opto-electronic modules with electrical and optical interconnections and methods for making

Tetsuzo Yoshimura; Yashuhito Takahashi; Masaaki Inao; Michael G. Lee; William T. Chou; Solomon I. Beilin; Wen-chou Vincent Wang; James Roman; Thomas J. Massingill

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