Larry L. Moresco | Researchain

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Featured researches published by Larry L. Moresco.

Archive | 1992

Wire interconnect structures for connecting an integrated circuit to a substrate

David G. Love; Larry L. Moresco; William T. Chou; David A. Horine; Connie Mak Wong; Solomon I. Beilin

Archive | 1995

Controlled impedence interposer substrate

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang; Larry L. Moresco; Teruo Murase

Archive | 2000

Universal multichip interconnect systems

Larry L. Moresco

Archive | 1995

Fabrication procedure for a stable post

William T. Chou; Solomon I. Beilin; David A. Horine; David Kudzuma; Michael G. Lee; Larry L. Moresco; Wen-chou Vincent Wang

Archive | 1993

Apparatus for cooling semiconductor chips in multichip modules

David G. Love; Larry L. Moresco; David A. Horine; Wen-chou V. Wang; Richard L. Wheeler; Patricia R. Boucher; Vivek Mansingh

Archive | 2001

Methods of planarizing structures on wafers and substrates by polishing

Solomon I. Beilin; Michael G. Lee; William T. Chou; Larry L. Moresco; Wen-chou Vincent Wang

Archive | 1995

Method for making a three-dimensional multichip module

Larry L. Moresco; David A. Horine; Wen-chou Vincent Wang

Archive | 2003

Multichip module substrates with buried discrete capacitors and components and methods for making

Larry L. Moresco

Archive | 1998

Controlled impedance interposer substrate and method of making

Solomon I. Beilin; William T. Chou; David Kudzuma; Michael G. Lee; Michael G. Peters; James Roman; Som S. Swamy; Wen-chou Vincent Wang; Larry L. Moresco; Teruo Murase

Archive | 2000