Sun-OO Kim
Infineon Technologies
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Publication
Featured researches published by Sun-OO Kim.
international interconnect technology conference | 2016
Sun-OO Kim; Shannon Dunn; Steven Smith; WenLi Collision; Jamie Prudhomme; Huey-Ming Wang; Joe Maniscalco; Nithin Yathapu; Chulgi Song; Barry Wang; Christopher R. Carr; Hsi-Wen Liu; Bruce Gall; Angelo Alaestante; Min-Hui Chen; Richard Conti; ChungJu Yang; Denis Sullivan; Kosta Culafi; BumKi Moon; Yii-Cheng Lin; Yu-Lieh Fu; Katherine Sieg; Anne-Sophie Larrea; Norman Fish; Regina Swaine; Alexander Bialy; Milo Tallon; Gerard Stapf; John Hagwood
At 450mm wafer area, the first Cu BEOL module process was demonstrated with a single damascene structure using low-k ILD, TiN metal hard mask and guided 20nm half-pitched lamella BCP DSA patterning. It showed the potential opportunities, technical feasibility and further challenges for coming needs for 450mm equipment.
Archive | 2004
Veit Klee; Sun-OO Kim
Archive | 2010
Sun-OO Kim; O Seo Park
Archive | 2008
Yoon-hae Kim; Sun-OO Kim
Archive | 2003
Sun-OO Kim
Archive | 2014
Jiang Yan; Henning Haffner; Frank Huebinger; Sun-OO Kim; Richard Lindsay; Klaus Schruefer
Archive | 2006
Sun-OO Kim; Ernst Demm
Archive | 2005
Thomas Goebel; Erdem Kaltalioglu; Sun-OO Kim
Archive | 2010
Sun-OO Kim; Muhammed Shafi Pallachalil; Moosung Chae; Erdem Kaltalioglu
Archive | 2005
Thomas Goebel; Erdem Kaltalioglu; Sun-OO Kim
