Sung-Cheol Park

Effect of Temperature/Humidity Treatment Conditions on Interfacial Adhesion Energy between Inkjet-Printed Ag and Polyimide

The effect of temperature/humidity treatment conditions on the interfacial adhesion energy of inkjet-printed Ag/polyimide systems was investigated for metallization of inkjet printing techniques in flexible printed circuit board applications. The interfacial adhesion energy was determined from 180° peel tests by calculating the plastic deformation energy of peeled metal and polyimide films from the energy balance relationship during the steady-state peeling process. After 76 h of temperature/humidity treatment, there is an increase in interfacial adhesion energy. This is a chemical bonding effect because there exists good quantitative correlations between the interfacial bonding energy and the Ag* peak area fraction from X-ray photoemission spectroscopy (XPS) data of peeled metal surfaces. After 196 and 388 h of temperature/humidity treatment, there is a decrease in interfacial adhesion energy, which seems to degrade polyimide by hydrolysis reaction with water molecules.

Effect of Annealing Treatment Conditions on the Interfacial Adhesion Energy of Electroless-plated Ni on Polyimide

The effect of annealing treatment conditions on the interfacial adhesion energy between electroless- plated Ni film and polyimide substrate was evaluated using a 180 peel test. Measured peel strength values are 26.9 ± 0.8, 22.4 ± 0.8, 21.9 ± 1.5, 23.1 ± 1.3, 16.1 ± 2.0 and 14.3 ± 1.3 g/mm for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at 200 C in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

Effects of Temperature and Humidity Treatment Conditions on the Interfacial Adhesion Energy between the Electroless-Plated Ni and Polyimide

The effect of temperature/humidity treatment conditions on the interfacial adhesion energy between an electroless-plated Ni film and a polyimide substrate was evaluated by using a 180° peel test. The measured peel strength values decrease from 506.1 ±18.6 to 231.9 ±33.3 J/m2 due to the temperature/humidity treatment at 85 °C/85% relative humidity for 1000 h. X-ray photoelectron spectroscopy analysis of the peeled surfaces indicates that peeling occurs cohesively inside of the polyimide; this is related to both the decrease in the interfacial adhesion energy and the polyimide degradation when small quantities of the remaining alkali ions react with the polyimides functional groups during the temperature/humidity treatment.

Effect of Wet Chemical Pretreatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films

How KOH and ethylenediamine (EDA) pretreatment conditions on polyimide film surfaces affect the interfacial adhesion energy between electroless-plated Ni and polyimide film was investigated by the 180° peel test. Estimated values of interfacial adhesion energy monotonically increase from 240.3 to 326.0 J/m2 by increasing the KOH treatment time from 1 to 5 min, and they monotonically decrease from 310.2 to 219.0 J/m2 by increasing the EDA treatment time from 1 to 5 min. It was found that chemical pretreatment produces carboxyl bonding, which is closely related to the strong interfacial bonding mechanism and leads to cohesive failure. Finally, it is speculated that the interfacial adhesion energy seems to be controlled by carboxyl bonding on polyimides surface during KOH and EDA treatment.

Effect of Bonding Process Conditions on the Interfacial Adhesion Energy of Al-Al Direct Bonds

【3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and

Interfacial Adhesion Characteristics Between Electroless-Plated Ni and Polyimide Films Modified by Alkali Surface Pretreatment

6.44\;J/m^2

Effect of Annealing on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide

for 400, 450, and

Effect of CF4 plasma treatment on the interfacial fracture energy between inkjet-printed Ag and flexible polyimide films

500^{\circ}C

Effect of Post-Baking Treatment Conditions on the Interfacial Adhesion Energy between Electroless-Plated Ni and Polyimide Films

, respectively, in a

Ag Pore Effect on the Interfacial Debonding Energy of an Inkjet-Printed Ag Film on Polyimide

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