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Featured researches published by Sung-tae Kim.


Meeting Abstracts | 2007

Evaluation of Novel Sr Precursors for Atomic Layer Deposition of SrO Thin Film

Ki-chul Kim; Kyuho Cho; Kwang-Hee Lee; Youn-Soo Kim; Jae H. Choi; Jae-soon Lim; Jin Y. Kim; Wan-Don Kim; Oh Seong Kwon; Yong Suk Tak; Jeong-Hee Chung; Young-sun Kim; Sung-tae Kim; Woosung Han

Atomic layer deposition (ALD) process to deposit SrO film using novel Sr precursor – Sr (Methoxy-TetramethylHeptadiene)2 was estimated. Fig.1 showed the chemical structure of the synthesized Sr(MTHD)2. Fig. 2 showed thermal gravimetric analysis results of Sr(MTHD)2 and commercially used Sr (Tetra-Methyl Hetadiene)2. 50 % precursor evaporation temperature (T50) of Sr (MTHD)2 was 330 C, which was 30 C lower than that of Sr(TMHD)2. Liquid delivery system with flash evaporator was used to transport the precursors to substrate. The precursors were dissolved in Tetra Hydro Furan (THF) to prevent clogging during the delivery process. Ozone was used as a reactant to deposit SrO. It was found that thickness uniformity range of SrO film on Si wafer was less than 2 %. The deposition rate of SrO film using new Sr precursor was 0.4 A/cycle, which was almost same regardless of substrate temperatures up to 400 C. High vapor pressure and good thermal stability of new Sr precursor make it promising candidates for ALD precursors to deposit SrTiO3, aSrTiO3. Fig.1. Chemical structure of Sr(MTHD)2


Ferroelectrics | 2002

Metal Organic Chemical Vapor Deposition of (Ba,Sr)RuO 3 Conductive Oxide Film for (Ba,Sr)TiO 3

Duck-Kyun Choi; Duck-Hwa Hong; Joong-Seo Kang; Hyun-Chul Kim; Young-Bae Kim; Young Ho Kim; Sung-tae Kim; Cha-young Yoo; Hideki Horii

(Ba,Sr)RuO 3 films have been tailored as an electrode for (Ba,Sr)TiO 3 which is a promising material for the high dielectric in ULSI DRAM. In this study, BSR conductive oxide film was deposited on 4-inch Si-wafer by metal organic chemical vapor deposition (MOCVD) using single cocktail source for the practical device application. Liquid delivery system (LDS) and vaporization cell were utilized for the delivery and vaporization of single cocktail source, respectively. The source feeding rate was controlled by liquid mass flow controller(LMFC). Ba(METHD) 2 , Sr(METHD) 2 , Ru(METHD) 3 precursors and solvent [n-butylacetate(C 6 H 12 O 2 )] were mixed for single coctail source. Among the various deposition parameters, control of the oxygen flow rate turned out to be crucial for determining the phase formation, resistivity, and the composition ratio of (Ba,Sr)RuO 3 films. Highly (110)-textured (Ba,Sr)RuO 3 film was obtained when Ar/O 2 ratio was 100/300sccm with the source flow rate of 0.075sccm. Oxygen annealing of (Ba,Sr)RuO 3 films enhanced the properties of the films without changing the (110) texture, and the resistivity of the resulted film was 2440 w z cm.


MRS Proceedings | 2001

Characterization of (Ba,Sr)RuO 3 Films Deposited by Metal-organic Chemical Vapor Deposition

Duck-Kyun Choi; Joong-Seo Kang; Young-Bae Kim; Duck-Hwa Hong; Hyun-Chul Kim; Sung-tae Kim; Cha-young Yoo

(Ba, Sr)RuO3 oxide electrodes have been studied for high dielectric (Ba, Sr)TiO3 film in DRAM capacitors. Metal organic chemical vapor deposition (MOCVD) is used for large-scale deposition and provides better step coverage properties. In this work, methoxyethoxytetramethylheptanedionate (METHD) precursor and solvent [n-butylacetate(C6H12O2)] were mixed together into a single solution source. Post deposition annealing is carried out in oxygen atmosphere using rapid thermal annealing (RTA) to investigate the effect of organic impurities such as carbon during deposition. After annealing, resistivity of the BSR film decreased drastically compared to the as-deposited film. X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) analysis were used to describe this phenomenon accurately. The decrease in carbonate with increasing annealing time was confirmed by XRD analysis. 2004 Elsevier B.V. All rights reserved.


Archive | 2005

Trench capacitors with insulating layer collars in undercut regions and method of fabricating the same

Suk-Jin Chung; Seung-Hwan Lee; Sung-tae Kim; Young-sun Kim; Jae-soon Lim; Young-Geun Park


Archive | 2004

METHOD OF FORMING HIGH DIELECTRIC FILM USING ATOMIC LAYER DEPOSITION AND METHOD OF MANUFACTURING CAPACITOR HAVING THE HIGH DIELECTRIC FILM

Kyoung-Seok Kim; Hong-bae Park; Bong-Hyun Kim; Sung-tae Kim; Jong-wan Kwon; Jung-hyun Lee; Ki-chul Kim; Jae-soon Lim; Gab-jin Nam; Young-sun Kim


Archive | 2005

Method of forming a layer and forming a capacitor of a semiconductor device having the same layer

Jong-Cheol Lee; Ki-Vin Im; Sung-tae Kim; Young-sun Kim; Cha-young Yoo; Han-mei Choi; Gab-jin Nam; Seung-Hwan Lee


Archive | 2005

Method of forming a layer and method of forming a capacitor of a semiconductor device having the same

Jong-Cheol Lee; Ki-Vin Im; Sung-tae Kim; Young-sun Kim; Cha-young Yoo; Han-mei Choi; Gab-jin Nam


Archive | 2004

METHODS OF FORMING METAL THIN FILMS, LANTHANUM OXIDE FILMS, AND HIGH DIELECTRIC FILMS FOR SEMICONDUCTOR DEVICES USING ATOMIC LAYER DEPOSITION

Ki-yeon Park; Sung-tae Kim; Young-sun Kim; In-sung Park; Jae-hyun Yeo; Yun-jung Lee; Ki-Vin Im


Archive | 2004

High performance MIS capacitor with HfO2 dielectric

Ki-Vin Im; Ki-yeon Park; Jae-hyun Yeo; In-sung Park; Seung-Hwan Lee; Young-sun Kim; Sung-tae Kim


Archive | 2004

Methods of forming MIM type capacitor structures using low temperature plasma processing

Se-hoon Oh; Jung-Hee Chung; Jae-Hyoung Choi; Jeong-Sik Choi; Sung-tae Kim; Cha-young Yoo

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