Susanne Wehner

METHOD OF FORMING A METAL LAYER OVER A PATTERNED DIELECTRIC BY WET CHEMICAL DEPOSITION INCLUDING AN ELECTROLESS AND A POWERED PHASE

Invited) Integration Challenges for Copper Damascene Electroplating

Method of forming a metal directly on a conductive barrier layer by electrochemical deposition using an oxygen-depleted ambient

Profile control on ring anode plating chambers for multi-step recipes

Integrated Profile Control from ECP to CMP

Profilsteuerung in Ringanodenplattierkammern für Vielschrittrezepte

Integration Challenges for Copper Damascene Electroplating: An Invited Talk

Profilsteuerung in Ringanodenplattierkammern für Vielschrittrezepte Profile control in Ringanodenplattierkammern for multi-step recipes

Profile control in Ringanodenplattierkammern for multistep recipes

Verfahren zur Herstellung eines Metalls direkt auf einer leitenden Barrierenschicht durch elektrochemische Abscheidung unter Anwendung einer sauerstoffarmen Umgebung A process for the production of a metal directly onto a conductive barrier layer by electrochemical deposition using a low oxygen environment