Axel Preusse

Comprehensive reliability analysis of CoWP Metal Cap unit processes for high volume production in sub-μm dimensions

Reliability of copper interconnect systems is very sensitive to the maximum current used in the product. In this paper we present the results of advanced process improvements leading to very reliable full-build interconnect systems ready for high volume production. Besides the electromigration investigation, we studied stress migration performance as well as BTS and leakage measurements. We found behavior changes in almost all reliability tests suggesting differences in physical behavior, while exhibiting very strong lifetime performance.

Process options for improving electromigration performance in 32nm technology and beyond

In this paper we present process options to close the gap between electromigration performance needs by design and process performance. We are going to present reliability data for metal capping and advanced copper surface cleaning processes. These processes are showing very good performance and extendibility to 32nm technology nodes and beyond.