Tae-yeol Heo

Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contamination and methods of forming same

Methods and systems for measuring microroughness of a substrate combining particle counter and atomic force microscope measurements

Wafer surface inspection method

Semiconductor wafers having asymmetric edge profiles that facilitate high yield processing by inhibiting particulate contamination

Susceptor and deposition apparatus including the same

Apparatus for analyzing a substrate employing a copper decoration

Method of analyzing morphology of bulk defect and surface defect on semiconductor wafer

Slurry compositions for polishing wafers used in integrated circuit devices and cleaning compositions for removing electron wax after polishing

Semiconductor wafer, has asymmetric edge profile extending between inner and outer edge profiles with arc that defines inner profile at point of intersection with top surface of wafer

Halbleiterwafer mit asymmetrischem Kantenprofil und Herstellungsverfahren hierfür A semiconductor wafer with an asymmetric edge profile and manufacturing method thereof