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泰正 盛島

The Furukawa Electric Co., Ltd.

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Publication

Featured researches published by 泰正 盛島.

Archive | 2004

Semiconductor device manufacturing method and wafer processing tape

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; Takanori Yamakawa; 賢二 喜多; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2005

TAPE FOR PROCESSING WAFER AND METHOD OF MANUFACTURING CHIP USING THE SAME

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2006

Chip protecting film

Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2009

FILM FOR CHIP PROTECTION

Kunihiko Ishiguro; Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡; 邦彦 石黒

Archive | 2004

Tape for wafer processing and manufacturing method thereof

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2005

PROTECTIVE FILM FORMING SHEET FOR CHIP

Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2005

Dicing die bond tape and dicing tape

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; Yosuke Ogawara; Arimichi Tamagawa; 賢二 喜多; 洋介 大河原; 有理 玉川; 泰正 盛島; 伸一 石渡

Archive | 2003

Adhesive tape for sticking wafer

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2006

Method for forming protective film using protective-film-forming sheet for chip

Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2003

PRESSURE SENSITIVE ADHESIVE TAPE FOR DICING

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

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Collaboration

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Yasumasa Morishima

The Furukawa Electric Co.

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Kenji Kita

The Furukawa Electric Co.

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Takanori Yamakawa

The Furukawa Electric Co.

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恭宏 飯田

The Furukawa Electric Co.

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片岡 次雄

The Furukawa Electric Co.

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英和 原

The Furukawa Electric Co.

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貴和 伊藤

The Furukawa Electric Co.

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Hidekazu Hara

The Furukawa Electric Co.

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Mitsuya Inoue

The Furukawa Electric Co.

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Osamu Kato

The Furukawa Electric Co.

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