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Yasumasa Morishima

The Furukawa Electric Co., Ltd.

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Publication

Featured researches published by Yasumasa Morishima.

Archive | 2012

Wafer processing tape

Kenji Kita; Yasumasa Morishima; Shinichi Ishiwata; Akira Yabuki

Archive | 2004

Semiconductor device manufacturing method and wafer processing tape

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; Takanori Yamakawa; 賢二 喜多; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2007

Method of producing a semiconductor device, and wafer-processing tape

Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata; Takanori Yamakawa

Archive | 2005

Dicing/die bonding sheet

Keiichi Hatakeyama; Michio Uruno; Takayuki Matsuzaki; Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata

Archive | 2005

TAPE FOR PROCESSING WAFER AND METHOD OF MANUFACTURING CHIP USING THE SAME

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2006

Chip protecting film

Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2009

FILM FOR CHIP PROTECTION

Kunihiko Ishiguro; Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡; 邦彦 石黒

Archive | 2004

Tape for wafer processing and manufacturing method thereof

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2005

Dicing/die boding sheet

Keiichi Hatakeyama; Michio Uruno; Takayuki Matsuzaki; Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata

Archive | 2005

PROTECTIVE FILM FORMING SHEET FOR CHIP

Shinichi Ishiwatari; Yasumasa Morishima; Takanori Yamakawa; 貴紀 山川; 泰正 盛島; 伸一 石渡

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Collaboration

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泰正 盛島

The Furukawa Electric Co.

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Kenji Kita

The Furukawa Electric Co.

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Shinichi Ishiwata

The Furukawa Electric Co.

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Hidekazu Hara

The Furukawa Electric Co.

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Mitsuya Inoue

The Furukawa Electric Co.

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Osamu Kato

The Furukawa Electric Co.

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Takahiro Iida

The Furukawa Electric Co.

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Takayori Ito

The Furukawa Electric Co.

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Tatsuhiro Yaegashi

The Furukawa Electric Co.

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Takanori Yamakawa

The Furukawa Electric Co.

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