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Kenji Kita

The Furukawa Electric Co., Ltd.

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Publication

Featured researches published by Kenji Kita.

Archive | 2012

Wafer processing tape

Kenji Kita; Yasumasa Morishima; Shinichi Ishiwata; Akira Yabuki

Archive | 2004

Semiconductor device manufacturing method and wafer processing tape

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; Takanori Yamakawa; 賢二 喜多; 貴紀 山川; 泰正 盛島; 伸一 石渡

Archive | 2007

Method of producing a semiconductor device, and wafer-processing tape

Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata; Takanori Yamakawa

Archive | 2005

Dicing/die bonding sheet

Keiichi Hatakeyama; Michio Uruno; Takayuki Matsuzaki; Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata

Archive | 2005

TAPE FOR PROCESSING WAFER AND METHOD OF MANUFACTURING CHIP USING THE SAME

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2004

Tape for wafer processing and manufacturing method thereof

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2005

Dicing/die boding sheet

Keiichi Hatakeyama; Michio Uruno; Takayuki Matsuzaki; Yasumasa Morishima; Kenji Kita; Shinichi Ishiwata

Archive | 2005

Dicing die bond tape and dicing tape

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; Yosuke Ogawara; Arimichi Tamagawa; 賢二 喜多; 洋介 大河原; 有理 玉川; 泰正 盛島; 伸一 石渡

Archive | 2003

Adhesive tape for sticking wafer

Shinichi Ishiwatari; Kenji Kita; Yasumasa Morishima; 賢二 喜多; 泰正 盛島; 伸一 石渡

Archive | 2006

Wafer-processing tape and method of producing the same

Kenji Kita; Yasumasa Morishima; Shinichi Ishiwata

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Collaboration

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Yasumasa Morishima

The Furukawa Electric Co.

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泰正 盛島

The Furukawa Electric Co.

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Shinichi Ishiwata

The Furukawa Electric Co.

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Takanori Yamakawa

The Furukawa Electric Co.

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Akira Yabuki

The Furukawa Electric Co.

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Keiichi Hatakeyama

The Furukawa Electric Co.

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Michio Uruno

The Furukawa Electric Co.

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Takayuki Matsuzaki

The Furukawa Electric Co.

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Keiichi Hatakeyama

The Furukawa Electric Co.

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Michio Uruno

The Furukawa Electric Co.

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