Takashi Imoto
Toshiba
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Publication
Featured researches published by Takashi Imoto.
electronic components and technology conference | 2001
Takashi Imoto; Mikio Matsui; Chiaki Takubo; Shuzo Akejima; Takashi Kariya; Tatsuya Nishikawa; Ryo Enomoto
As the mobile electronics equipment moves toward higher performance and miniaturizing, each IC package is required to be stacked for saving a package mounting area on a system board. This paper describes a newly developed 3-dimensional module package using the technology of the silicon device thinning, micro flip chip bonding and two types of via connection of print circuit board for vertical wirings. These technology has realized the high density packaging of over 4 ICs stacking for practical use.
Archive | 2002
Takashi Imoto
Archive | 2002
Hiroshi Shimoe; Naohisa Okumura; Takashi Imoto; Ryuji Hosokawa
Archive | 2006
Hiroshi Hamasaki; Hideto Furuyama; Hideo Numata; Takashi Imoto
Archive | 2005
Ryuji Hosokawa; Takashi Imoto
Archive | 1998
Takaharu Hosokawa; Takashi Imoto; Naohisa Okumura; Hiroshi Shimoe; 宏 下江; 孝志 井本; 尚久 奥村; 隆治 細川
Archive | 2005
Takashi Imoto; Chiaki Takubo; Ryuji Hosokawa; Yoshihisa Imori; Takao Sato; Tetsuya Kurosawa; Mika Kiritani
Archive | 2007
Takashi Imoto; Chiaki Takubo; Ryuji Hosokawa; Yoshihisa Imori; Takao Sato; Tetsuya Kurosawa; Mika Kiritani
Archive | 2002
Katsuhiko Oyama; Mitsuyoshi Endo; Chiaki Takubo; Takashi Yamazaki; Takashi Imoto
Archive | 2014
Yoshiaki Goto; Takashi Imoto; Takeshi Watanabe; Yuusuke Takano; Yusuke Akada; Yuji Karakane; Yoshinori Okayama; Akihiko Yanagida
