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Tetsushi Wakabayashi

Fujitsu

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Publication

Featured researches published by Tetsushi Wakabayashi.

Archive | 1983

Integrated circuit device having package with bypass capacitor

Tetsushi Wakabayashi; Kiyoshi Muratake

Archive | 1984

Heat sink for a semiconductor device

Tetsushi Wakabayashi; Norio Honda; Osamu Sakuma

Archive | 1997

Semiconductor device and assembly board having through-holes filled with filling core

Makoto Iijima; Tetsushi Wakabayashi; Toshio Hamano; Masaharu Minamizawa; Masashi Takenaka; Taturou Yamashita; Masataka Mizukoshi

Archive | 1989

Integrated circuit device having an improved package structure

Akihiro Oku; Souichi Aonuma; Tetsushi Wakabayashi

Archive | 2000

Method of forming an assembly board with insulator filled through holes

Makoto Iijima; Tetsushi Wakabayashi; Toshio Hamano; Masaharu Minamizawa; Masashi Takenaka; Taturou Yamashita; Masataka Mizukoshi

Archive | 1988

SEMICONDUCTOR DEVICES PROVIDED WITH HEAT-DISSIPATING MEANS

Hideji Aoki; Masahiro Sugimoto; Tetsushi Wakabayashi; Kiyoshi Muratake

Archive | 1984

Semiconductor device assembly

Masahiro Sugimoto; Tetsushi Wakabayashi; Kiyoshi Muratake

Archive | 1981

A semiconductor integrated circuit device with an improved heat sink

Tetsushi Wakabayashi; Norio Honda; Osamu Sakuma

Archive | 1996

Integrated circuit carrier having lead-socket array with various inner dimensions

Kazuhiro Tashiro; Tetsushi Wakabayashi

Archive | 1991

Semiconductor package having improved mechanical stability for holding interconnection leads and improved capability of hermetic sealing.

Tetsushi Wakabayashi; Yoshihiro Kubota

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Kiyoshi Muratake

Fujitsu

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Makoto Iijima

Fujitsu

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Masaharu Minamizawa

Fujitsu

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Masahiro Sugimoto

Fujitsu

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Masashi Takenaka

Fujitsu

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Masataka Mizukoshi

Fujitsu

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Norio Honda

Fujitsu

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Osamu Sakuma

Fujitsu

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Taturou Yamashita

Fujitsu

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Toshio Hamano

Fujitsu

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