Theodore M. Lyszczarz

A new surface electron-emission mechanism in diamond cathodes

An electron-emission mechanism for cold cathodes is described based on the enhancement of electric fields at metal–diamond–vacuum triple junctions. Unlike conventional mechanisms, in which electrons tunnel from a metal or semiconductor directly into vacuum, the electrons here tunnel from a metal into diamond surface states, where they are accelerated to energies sufficient to be ejected into vacuum. Diamond cathodes designed to optimize this mechanism exhibit some of the lowest operational voltages achieved so far.

Photonic ADC: overcoming the bottleneck of electronic jitter

Accurate conversion of wideband multi-GHz analog signals into the digital domain has long been a target of analog-to-digital converter (ADC) developers, driven by applications in radar systems, software radio, medical imaging, and communication systems. Aperture jitter has been a major bottleneck on the way towards higher speeds and better accuracy. Photonic ADCs, which perform sampling using ultra-stable optical pulse trains generated by mode-locked lasers, have been investigated for many years as a promising approach to overcome the jitter problem and bring ADC performance to new levels. This work demonstrates that the photonic approach can deliver on its promise by digitizing a 41 GHz signal with 7.0 effective bits using a photonic ADC built from discrete components. This accuracy corresponds to a timing jitter of 15 fs - a 4-5 times improvement over the performance of the best electronic ADCs which exist today. On the way towards an integrated photonic ADC, a silicon photonic chip with core photonic components was fabricated and used to digitize a 10 GHz signal with 3.5 effective bits. In these experiments, two wavelength channels were implemented, providing the overall sampling rate of 2.1 GSa/s. To show that photonic ADCs with larger channel counts are possible, a dual 20-channel silicon filter bank has been demonstrated.

Comparison of electric field emission from nitrogen‐doped, type Ib diamond, and boron‐doped diamond

Field emission of electrons from boron‐ and nitrogen‐doped diamond is compared. Emission from boron‐doped diamond requires vacuum electric fields of 20–50 V μm−1, while nitrogen‐doped, type Ib diamond requires fields of 0–1 V μm−1. Since boron‐doped diamond is very conductive, very little voltage drop occurs in the diamond during emission. Nitrogen‐doped diamond is insulating, so during emission a potential of 1–10 kV appears in the diamond. This potential is a function of the back contact metal‐diamond interface. A roughened interface substantially reduces the potential in the diamond and increases emission. The electrons are often emitted from the nitrogen‐doped diamond as beamlets. These beamlets leave the surface of the diamond at angles up to 45° from the substrate normal. Although the vacuum field is small, these electrons have energies of several kV. It is unknown whether the electrons are accelerated to these energies in the bulk of the diamond, or at high electric fields near the emitting surface.

CMOS-Compatible All-Si High-Speed Waveguide Photodiodes With High Responsivity in Near-Infrared Communication Band

Submicrometer silicon photodiode waveguides, fabricated on silicon-on-insulator substrates, have photoresponse from <1270 to 1740 nm (0.8 AW-1 at 1550 nm) and a 3-dB bandwidth of 10 to 20 GHz. The p-i-n photodiode waveguide consists of an intrinsic waveguide 500times250 nm where the optical mode is confined and two thin, 50-nm-thick, doped Si wings that extend 5 mum out from either side of the waveguide. The Si wings, which are doped one p-type and the other n-type, make electric contact to the waveguide with minimal effect on the optical mode. The edges of the wings are metalized to increase electrical conductivity. Ion implantation of Si+ 1times10 13 cm-2 at 190 keV into the waveguide increases the optical absorption from 2-3 dBmiddotcm-1 to 200-100 dBmiddotcm-1 and causes the generation of a photocurrent when the waveguide is illuminated with subbandgap radiation. The diodes are not damaged by annealing to 450 degC for 15 s or 300 degC for 15 min. The photoresponse and thermal stability is believed due to an oxygen stabilized divacancy complex formed during ion implantation

Silicon waveguide infrared photodiodes with >35 GHz bandwidth and phototransistors with 50 AW -1 response

SOI CMOS compatible Si waveguide photodetectors are made responsive from 1100 to 1750 nm by Si+ implantation and annealing. Photodiodes have a bandwidth of >35 GHz, an internal quantum efficiency of 0.5 to 10 AW-1, and leakage currents of 0.5 nA to 0.5 microA. Phototransistors have an optical response of 50 AW-1 with a bandwidth of 0.2 GHz. These properties are related to carrier mobilities in the implanted Si waveguide. These detectors exhibit low optical absorption requiring lengths from <0.3 mm to 3 mm to absorb 50% of the incoming light. However, the high bandwidth, high quantum efficiency, low leakage current, and potentially high fabrication yields, make these devices very competitive when compared to other detector technologies.

Fabrication of crystalline organic waveguides with an exceptionally large electro-optic coefficient

Single-crystal optical waveguides of 4-dimethylamino-N-methyl-4-stilbazolium tosylate (DAST), an organic material with a large electro-optic coefficient, have been obtained. DAST decomposes at its melting temperature, making its growth from the melt difficult. However, graphoepitaxy allows for >1 mm s−1 growth, 1×105 times faster than conventional techniques, and produces crystals of the correct dimensions for optical waveguides, 1–15 μm on a side and 5–10 mm long. The crystals grow with the c-axis normal to the substrate, and with in-plane orientation determined by lithographic patterning. The electro-optic coefficient dn/dE is 600±300 pm V−1 at 1.55 μm wavelength. Optical losses are <10 dB cm−1.

CMOS-compatible dual-output silicon modulator for analog signal processing.

A broadband, Mach-Zehnder-interferometer based silicon optical modulator is demonstrated, with an electrical bandwidth of 26 GHz and V(pi)L of 4 V.cm. The design of this modulator does not require epitaxial overgrowth and is therefore simpler to fabricate than previous devices with similar performance.

Terahertz measurements of resonant planar antennas coupled to low‐temperature‐grown GaAs photomixers

Resonant slot and dipole antennas coupled to low‐temperature‐grown GaAs photomixers have been fabricated and tested at terahertz operating frequencies. Enhanced output power is seen from the resonant structures compared to mixers coupled to broadband self‐complementary spiral antennas. Driving point impedances as high as 300 Ω are attained at the resonant frequencies. These devices will be useful as fixed frequency local oscillators for submillimeter heterodyne receivers.

Line-edge roughness in sub-0.18-μm resist patterns

We have characterized line-edge roughness in single-layer, top-surface imaging, bilayer and trilayer resist schemes. The results indicate that in dry developed resists there is inherent line-edge roughness which results from the etch mask, resist (planarizing layer) erosion, and their dependence on plasma etch conditions. In top surface imaging the abruptness of the etch mask, i.e., the silylation contrast, and the silicon content in the silylated areas are the most significant contributors to line-edge roughness. Nevertheless, even in the case of a trilayer, where the SiO2 layer represents the near ideal mask, there is still resist sidewall roughness of the planarizing layer observed which is plasma induced and polymer dependent. The mechanism and magnitude of line-edge roughness are different for different resist schemes, and require specific optimization. Plasma etching of silicon, like O2 dry development, contributes to the final line-edge roughness of patterned features.

All silicon infrared photodiodes: photo response and effects of processing temperature

CMOS compatible infrared waveguide Si photodiodes are made responsive from 1100 to 1750 nm by Si(+) implantation and annealing. This article compares diodes fabricated using two annealing temperatures, 300 and 475 degrees C. 0.25-mm-long diodes annealed to 300 degrees C have a response to 1539 nm radiation of 0.1 A W-(-1) at a reverse bias of 5 V and 1.2 A W(-1) at 20 V. 3-mm-long diodes processed to 475 degrees C exhibited two states, L1 and L2, with photo responses of 0.3 +/-0.1 A W(-1) at 5 V and 0.7 +/-0.2 A W(-1) at 20 V for the L1 state and 0.5 +/-0.2 A W(-1) at 5 V and 4 to 20 A W(-1)-1 at 20 V for the L2 state. The diodes can be switched between L1 and L2. The bandwidths vary from 10 to 20 GHz. These diodes will generate electrical power from the incident radiation with efficiencies from 4 to 10 %.