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Thies Janczek

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Publication

Featured researches published by Thies Janczek.

Archive | 1998

Semiconductor element having a carrying device and a lead frame and a semiconductor chip connected thereto

Achim Neu; Thies Janczek; Günter Tutsch

Archive | 1999

Pressure sensor component and production method

Jürgen Winterer; Eric Bootz; Bernd Stadler; Achim Neu; Thies Janczek

Archive | 1998

Chip card and method of manufacturing a chip card

Manfred Fries; Thies Janczek

Archive | 2001

Method of producing a pressure sensor component

Jürgen Winterer; Eric Bootz; Bernd Stadler; Achim Neu; Thies Janczek

Archive | 1997

Production of non-contact smart cards with printed information

Frank Pueschner; Thies Janczek

Archive | 1998

Plastic material for electronic applications contains a negative thermal expansion coefficient filler

Thies Janczek; Guenter Tutsch

Archive | 1998

Plastic composite body

Alexandra Atzesdorfer; Achim Neu; Thies Janczek

Archive | 1999

Semiconductor sensor component

Thies Janczek; Bernd Stadler; Detlef Houdeau

Archive | 1997

Chip card and semiconductor module for chip card

Detlef Dr Ing Houdeau; Erik Heinemann; Thies Janczek

Archive | 1998

Method for producing electroconductive structures

Achim Neu; Thies Janczek

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Achim Neu

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Bernd Stadler

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Eric Bootz

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Detlef Houdeau

Infineon Technologies

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Alexandra Atzesdorfer

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Erik Heinemann

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Juergen Winterer

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Jürgen Winterer

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Günter Tutsch

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Frank Pueschner

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