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Journal of Chromatography A | 1991

Elution behaviour of polyamic acid and polyamide-imide in size-exclusion chromatography

Yoshiyuki Mukoyama; Naoto Shimizu; Toichi Sakata; Sadao Mori

Abstract The causes of the peculiarities of the elution behaviour of thermoresistant resins, when N,N-dimethylformamide (DMF) is used as the mobile phase were investigated. In order to establish whether the peculiarities are caused by the properties of DMF, by the interactions between the stationary phase and DMF, or by the generation of specific properties of the solutes in DMF, tetrahydrofuran (THF)-soluble polyamic and polyamide—imide resins were prepared. Two stationary phases, hydrophobic polystyrene gel and hydrophilic polymer gel, were used and DMF, THF and a mixture of DMF and THF with or without H 3 PO 4 and LiBr were used as the mobile phases. The peculiarities are discussed from the point of dissociation of carboxylic groups of the solutes and of the hydrophilic stationary phase. Adsorption of the resins on the columns or early elution from the columns were prevented by the addition of H 3 PO 4 and early elution of the neutral polyamide—imide from the column was prevented by the addition of LiBr. The early elution of the resins was not due to the intramolecular chain expansion of the resins in DMF, but to the interactions between carboxylic groups of the resins and of the hydrophilic polymer gels. The addition of H 3 PO 4 suppressed the dissociation of carboxylic groups of the resins. DMF partially controls the dissociation of the carboxylic groups.


Archive | 1989

Solvent-soluble polyimide and production thereof

Yoshihiro Nomura; Kazuhito Hanabusa; Hiroshi Minamisawa; Takashi Morinaga; Toichi Sakata; Yoshiyuki Mukoyama; Hiroshi Nishizawa; Hiromu Miyajima


Archive | 1997

RESIN PASTE, FORMATION OF FILM, ELECTRONIC PART AND SEMICONDUCTOR DEVICE

Keizo Hirai; Tomohiro Hirata; Hiroshi Nishizawa; Toichi Sakata; 淘一 坂田; 圭三 平井; 知広 平田; ▲広▼ 西澤


Archive | 1997

Wet-heat-resistant modified polyamide imide resin paste and electronic component using same

Hiroyuki Kawakami; Hiroshi Nishizawa; Toichi Sakata; Kenji Suzuki; 淘一 坂田; 広幸 川上; ▲広▼ 西澤; 健司 鈴木


Archive | 1983

CLUTCH FACING RESISTANT TO MOISTURE ABSORPTION

Yuji Kobayashi; Mikio Mabe; Yoshiyuki Mukoyama; Toichi Sakata


Archive | 1989

Aromatic polyamide composition and production of transparent aromatic polyamide

Yoshiyuki Mukoyama; Hiroshi Nishizawa; Toichi Sakata


Archive | 1989

Process for the production of high molecular weight polyamide-imide resin

Toichi Sakata; Kenji Hattori; Yoshiyuki Mukoyama


Archive | 1998

Heat-resistant adhesives and semiconductor devices produced therewith

Toichi Sakata; Hiroshi Nishizawa; Keizo Hirai; Kenji Suzuki


Archive | 1988

POLYAMIDE-IMADE RESIN COMPOSITION

Yoshiyuki Mukoyama; Hiroshi Nishizawa; Toichi Sakata


Archive | 1999

Preparation of polyamic acid paste, polyamic acid paste and electronic part

Hiroshi Nishizawa; Toichi Sakata; 淘一 坂田; ▲廣▼ 西澤

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