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Featured researches published by Tomio Iizuka.


Journal of Applied Physics | 1990

Influence of ball-forming conditions on the hardness of copper balls

Jin Onuki; Masahiro Koizumi; Hitoshi Suzuki; Isao Araki; Tomio Iizuka

Effect of ball‐forming conditions on the microstructure and the hardness of balls has been investigated in order to obtain soft balls suitable for a reliable ball‐bonding process using copper wire. Copper balls formed in a room‐temperature shield gas are found to be harder by 6 Hv than fully annealed copper wires of the same purity. This is caused by many dislocation loops which are generated in balls due to inclusion of gaseous impurities from the atmosphere and due to rapid solidification. On the other hand, copper balls formed in a shield gas heated above 175 °C are found to be softer by the amount of 4.5 Hv than balls formed in a room‐temperature shield gas. This is due to disappearance of dislocation loops caused by the reduction of solidification rate and by elimination of gaseous impurities from the balls during solidification. Impurities, especially oxygen, are found to have a strong influence on the hardening of copper balls. From these results, we conclude that copper balls formed in a shield ga...


IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 1987

Investigation of Aluminum Ball Bonding Mechanism

Jin Onuki; Motoo Suwa; Masahiro Koizumi; Tomio Iizuka

The effects of various factors, e.g., ball hardness, amount of ball deformation, thickness, and surface cleanliness of the aluminum electrode, which can influence bonding strength were investigated. Metallurgical bonding between balls and electrodes occurs by rupturing the oxide film existing on the aluminum electrodes and proceeds from outside, inwards to the center of the bonds. The bonding strength is found to be a linear function of the true bonded area between balls and electrodes. The factors increasing the true bonded area are a high ball hardness, a large amount of deformation, a thick aluminum electrode, and a clean electrode surface. In addition, a high strength ball bonding comparable to gold can be realized by using aluminum alloy wires containing magnesium.


IEEE Transactions on Components, Hybrids, and Manufacturing Technology | 1985

Ball Formation in Aluminum Ball Bonding

Jin Onuki; Masateru Suwa; Tomio Iizuka; Susumu Okikawa

The effects of various factors, i.e., shield gas, current density, wire polarity, and wire material, which can influence oxidation of ball surfaces were investigated. Good quality aluminum balls were found to be formed if optimum electric and shield gas conditions were employed; for example, current density geq 2.5 GA/m2wire polarity: cathode; shield gas: Ar+H 2 . Good quality aluminum balls of 1.7 to 2.5 times the wire diameter could be formed by varying discharge time and/or current density. It was found that they could be obtained independently of the wire material. The relation between morphologies of aluminum balls and the degree Of oxidation was also investigated in order to examine the mechanism for obtaining a good quality bail. A close correlation was found between ball morphologies, i.e., eccentricity, sphericity, and constriction, and the degree of oxidation. The morphologies were significantly improved as the oxide film thickness was reduced.


Journal of Nuclear Science and Technology | 1969

Self-Limiting Power Excursion Characteristics of Light Water Reactor, (III) Instrumentation for HTR-Pulse Operation

Hidemasa Kato; Munemaro Imai; Shuji Yamada; Kiyoshi Inoue; Tomio Iizuka

The Hitachi Training Reactor (HTR) provided with pulse operation capability was utilized for an experimental study on the excursion characteristics of light water reactors. Measurements were performed on reactor power, reactor period, released energy, fuel temperature, fuel cladding strain, pressure in water channel and water activities. The reliability of the instruments and devices employed was confirmed to be satisfactory through pulse operation tests repeated 300 times, with inserted reactivities up to 1.50


Archive | 1980

Laser beam reflection system

Ryutarou Jimbou; Tomio Umino; Tomohiko Shida; Tomio Iizuka; Shoji Isobe

, with reactor periods down to 15 msec, and hot spot fuel temperatures up to 1,300°C. A description is also given of the instrumentation for the measurements and reactor operation.


Archive | 1977

Method for controlling an automatic pipe welder

Tsutomu Omae; Takanori Shibata; Keiziro Sakai; Tomio Iizuka; Takaichi Koyama


Archive | 1974

Semiconductor device having supporting electrode composite structure of metal containing fibers

Keiichi Kuniya; Tomio Iizuka; Masateru Suwa; Tomio Yasuda; Takeshi Sasaki; Sakae Kikuchi; Hideo Suzuki


Archive | 1976

Copper-carbon fiber composites and process for preparation thereof

Hideo Arakawa; Keiichi Kuniya; Takashi Namekawa; Tomio Iizuka


Archive | 1979

Method for pressure bonding metal members by utilizing eutectic reaction

Kunio Miyazaki; Takeo Tamamura; Tomio Iizuka; Hitoshi Suzuki; Izumi Ochiai


Archive | 1977

Cathode for cathode ray tube of directly heating type and process for producing the same cathode

Ko Soeno; Tomio Iizuka; Toshio Doi; Hisashi Ando; Testuo Oyama; Hiroshi Sakamoto; Akira Misumi

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