Network


Latest external collaboration on country level. Dive into details by clicking on the dots.

Hotspot


Dive into the research topics where Takeo Tamamura is active.

Publication


Featured researches published by Takeo Tamamura.


Quarterly Journal of The Japan Welding Society | 1989

Study of pressre joining of aluminum. (Report 2). Pressure joinig of aluminum utilizing eutectic reaction.

Kunio Miyazaki; Takeo Tamamura; Izumi Ochiai

We have developed a new pressure joining process of Al-Cu pipe joints utilizing an eutectic reaction as reported in a previous paper. In this report, the process has been applied for joining Al to Al by using insert foils at the joining interface.Al-Si hyper-eutectic alloy foils solidified rapidly from the melt was found to have an excellent bondability even in air.Joints with high mechanical properties comparable to those of Al base metal can be obtained under the following conditions: 1) Si contents in the Al-Si alloy foils are above 20 wt% 2) joining pressures are above 19.6MPa.The reason for being able to join successfully in air is considered that Al surface layers are melted and cleaned by the reaction between the Si of hyper-eutectic composition and Al.


Quarterly Journal of The Japan Welding Society | 1988

Studies on pressure joining of alumium. (Report 1). Pressure joining of aluminum and copper pipes utilizing eutectic reaction.

Kunio Miyazaki; Takeo Tamamura; Izumi Ochiai

A new pressure joining method has been developed for transition joints between aluminum and copper pipes. The joining procedure is characterized by the following steps. 1) The ends of aluminum and copper pipes are set into contact with each other under a initial pressure that does net result in plastic deformation of the pipes. 2) The pipes are rapidly heated by an induction mtehod up to a temperature just above the eutectic temperature. 3) After an adequate quantity of eutetic liquid is formed, a second pressure, which is highre than the initial pressure, is applied to exclude the eutectic liquid out of the interface. Changes in the length of aluminum and copper pipe are detected to estimate the quantity of eutectic liquid. When the length changes by a predetermined value, the heating is terminated to cool the joint and the second pressure is applied.Many pipes of diameter 8 mm were joined in a protective gas atmosphere under various condition for the amount of eutectic liquid and the second pressure. The joints were evaluated by a metallographic examination, mechanical tests and leak tests. The residual eutectic layer at the joining interface becomes thinner with increasing second pressure. Joints with a layer less than 0.1 μm in thickness were obtained at a pressure of 30 MPa. Joints with such thin layers never break down at the joining interface during repeated bending fracture tests, but the aluminum pipes break down outside the interface. The leak rate of helium in the joints with thin residual eutectic layers is less than 1×10-13Pa m3/s even after joints were subjected to repeated bendings, thermal cycles and flattening deformations.


Archive | 1979

Method for pressure bonding metal members by utilizing eutectic reaction

Kunio Miyazaki; Takeo Tamamura; Tomio Iizuka; Hitoshi Suzuki; Izumi Ochiai


Archive | 1978

Magnetic tape scanning assembly for use in video tape recorder and playback apparatus

Takeo Tamamura; Naotatsu Asahi; Makoto Nakayama; Masataka Kasai; Akira Saito; Toshimichi Terada


Archive | 1985

Magnetic separator matrix of cut pieces of an elongated crystalline magnetic alloy

Tetsuroh Minemura; Joo Ishihara; Masaichi Nagai; Takeo Tamamura


Archive | 1979

Verfahren zur herstellung einer pressverbindung zwischen metallteilen unter ausnutzung einer eutektischen reaktion

Kunio Miyazaki; Takeo Tamamura; Tomio Iizuka; Hitoshi Suzuki; Izumi Ochiai


Archive | 1992

Semiconductor device using annealed bonding wire

Jin Onuki; Masateru Suwa; Masahiro Koizumi; Tomio Iizuka; Takeo Tamamura


Archive | 1983

Resin encapsulated semiconductor device and method of manufacture thereof

Tomio Iizuka; Masahiro Koizumi; Jin Onuki; Masateru Suwa; Takeo Tamamura


Archive | 1990

METAL WIRE FOR USE IN INTEGRATED CIRCUITS AND METHOD OF MAKING IT

Jin Onuki; Masateru Suwa; Masahiro Koizumi; Tomio Iizuka; Takeo Tamamura


Archive | 1983

Method of manufacture of a resin encapsulated semiconductor device

Tomio Iizuka; Masahiro Koizumi; Jin Onuki; Masateru Suwa; Takeo Tamamura

Collaboration


Dive into the Takeo Tamamura's collaboration.

Researchain Logo
Decentralizing Knowledge