Tongbi Jiang

Method for fabricating BGA package using substrate with patterned solder mask open in die attach area

Apparatus and method of stacking die on a substrate

Semiconductor die back side surface and method of fabrication

Composite interposer for BGA packages

Adhesive composition for use in packaging applications

Method of depositing a thermoplastic polymer in semiconductor fabrication

BGA Package Having Substrate With Patterned Solder Mask Defining Open Die Attach Area

Multi-layered adhesive for attaching a semiconductor die to a substrate

Method for in-line testing of flip-chip semiconductor assemblies

Z-axis electrical contact for microelectronic devices