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Edward A. Schrock

Micron Technology

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Publication

Featured researches published by Edward A. Schrock.

Archive | 1998

Method for fabricating BGA package using substrate with patterned solder mask open in die attach area

Tongbi Jiang; Edward A. Schrock

Archive | 1999

Controlling packaging encapsulant leakage

Patrick W. Tandy; Joseph M. Brand; Brad D. Rumsey; Steven R. Stephenson; David J. Corisis; Todd O. Bolken; Edward A. Schrock; Brenton L. Dickey

Archive | 2000

Composite interposer for BGA packages

Tongbi Jiang; Edward A. Schrock

Archive | 2001

Adhesive composition for use in packaging applications

Chad A. Cobbley; Tongbi Jiang; Edward A. Schrock

Archive | 1999

BGA Package Having Substrate With Patterned Solder Mask Defining Open Die Attach Area

Tongbi Jiang; Edward A. Schrock

Archive | 1999

Multi-layered adhesive for attaching a semiconductor die to a substrate

Edward A. Schrock; Tongbi Jiang

Archive | 1997

Method and apparatus for verifying the presence or absence of a component

Sven Evers; Kevin Gibbons; Edward A. Schrock

Archive | 1998

Z-axis electrical contact for microelectronic devices

Tongbi Jiang; Edward A. Schrock

Archive | 2003

Method of making a flexible substrate with a filler material

Tongbi Jiang; Edward A. Schrock

Archive | 2004

Semiconductor device, electrical conductor system, and method of making

Edward A. Schrock

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Tongbi Jiang

Micron Technology

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Chad A. Cobbley

Micron Technology

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Brad D. Rumsey

Micron Technology

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Brenton L. Dickey

Micron Technology

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David J. Corisis

Micron Technology

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Joseph M. Brand

Micron Technology

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Kevin Gibbons

Micron Technology

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Patrick W. Tandy

Micron Technology

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Steven R. Stephenson

Micron Technology

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Sven Evers

Micron Technology

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