Chad A. Cobbley

Apparatus and method of stacking die on a substrate

Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member

Thin stacked ball-grid array package

Packages for semiconductor die

Moisture-resistant electronic device package and methods of assembly

Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities

Techniques for packaging multiple device components

Semiconductor die back side surface and method of fabrication

Method of locating conductive spheres utilizing screen and hopper of solder balls

Stacked die module and techniques for forming a stacked die module