Chad A. Cobbley | Researchain

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Publication

Featured researches published by Chad A. Cobbley.

Archive | 2000

Apparatus and method of stacking die on a substrate

Tongbi Jiang; Chad A. Cobbley

Archive | 2002

Process for providing electrical connection between a semiconductor die and a semiconductor die receiving member

Chad A. Cobbley

Archive | 2002

Thin stacked ball-grid array package

Todd O. Bolkin; Chad A. Cobbley

Archive | 2003

Packages for semiconductor die

Todd O. Bolken; Cary J. Baerlocher; David J. Corisis; Chad A. Cobbley

Archive | 2005

Moisture-resistant electronic device package and methods of assembly

Todd O. Bolken; Cary J. Baerlocher; Steven W. Heppler; Chad A. Cobbley

Archive | 1999

Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities

Todd O. Bolken; David L. Peters; Patrick W. Tandy; Chad A. Cobbley

Archive | 2004

Techniques for packaging multiple device components

Todd O. Bolken; Chad A. Cobbley

Archive | 2000

Semiconductor die back side surface and method of fabrication

Tongbi Jiang; Chad A. Cobbley

Archive | 2004

Method of locating conductive spheres utilizing screen and hopper of solder balls

Chad A. Cobbley; Michael B. Ball; Marjorie L. Waddel

Archive | 2004

Stacked die module and techniques for forming a stacked die module

Chad A. Cobbley; Timothy L. Jackson

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Collaboration

Dive into the Chad A. Cobbley's collaboration.

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Todd O. Bolken

Micron Technology

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Tongbi Jiang

Micron Technology

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John VanNortwick

Micron Technology

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Cary J. Baerlocher

Micron Technology

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Michael B. Ball

Micron Technology

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Marjorie L. Waddel

Micron Technology

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Bret K. Street

Micron Technology

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David J. Corisis

Micron Technology

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Jonathon G. Greenwood

Micron Technology

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Edward A. Schrock

Micron Technology

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