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international symposium on environmentally conscious design and inverse manufacturing | 2001

New halogen-free high elastic modulus build-up material

Nobuyuki Ogawa; Takeshi Horiuchi; Atsushi Takahashi; Takahiro Tanabe; Toshihisa Kumakura; Takayuki Suzuki

The authors have developed a new build-up material MCF-6000G, which has high elastic modulus and has the incombustibility of UL94 level V-0 without halogenated flame retardant. Applying high Tg epoxy resin and a special fibrous filler gave high elastic modulus. The halogen free incombustible system was achieved by combining the following techniques: adoption of aromatic-ring rich resin and carbonizing catalyst; addition of suitable metal hydroxides and fibrous filler; high density filling and filler/resin interface control. MCF-6000G contains no halogen and has a high elastic modulus, high Tg, low coefficient of thermal expansion (CTE), and sufficient processability. It will be a promising environmentally-friendly material for PWBs.


Archive | 2005

Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same

Shin Takanezawa; Koji Morita; Takako Watanabe; Toshihisa Kumakura; Hiroyuki Fukai; Hiroaki Fujita


Archive | 2005

Adhesion Assisting Agent Fitted Metal Foil, and Printed Wiring Board Using Thereof

Nobuyuki Ogawa; Hitoshi Onozeki; Takahiro Tanabe; Kenji Takai; Norio Moriike; Shin Takanezawa; Takako Ejiri; Toshihisa Kumakura


Archive | 1999

Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same

Toshihisa Kumakura; Takeshi Horiuchi; Kazuyuki Magome; Norifumi Shiraishi


Archive | 2005

Metal foil provided with adhesion auxiliary material and printed wiring board using same

Nobuyuki Ogawa; Hitoshi Onozeki; Takahiro Tanabe; Kenji Takai; Norio Moriike; Shin Takanezawa; Takako Ejiri; Toshihisa Kumakura


Archive | 1989

Adhesive composition for metal-clad laminates

Toshihisa Kumakura; Ken Nanaumi; Ryoichi Ikezawa; Hideki Eriguchi


Archive | 2007

Mit Adhäsionshilfsmittel ausgestattete Metallfolie und Leiterplatte, bei der diese verwendet wird

Nobuyuki Ogawa; Hitoshi Onozeki; Takahiro Tanabe; Kenji Takai; Norio Moriike; Shin Takanezawa; Takako Ejiri; Toshihisa Kumakura


Archive | 2005

Mit Adhäsionshilfsmittel ausgestattete Metallfolie und Leiterplatte, bei der diese verwendet wird Equipped with metal foil adhesion aids and PCB in which it is used

Takako Ejiri; Toshihisa Kumakura; Norio Moriike; Nobuyuki Ogawa; Hitoshi Onozeki; Kenji Takai; Shin Takanezawa; Takahiro Tanabe


Archive | 2004

Isolierende Harzzusammensetzung und deren Verwendung Insulating resin composition and the use thereof

Shin Takanezawa; Koji Morita; Takako Watanabe; Toshihisa Kumakura; Hiroyuki Fukai; Hiroaki Fujita


Archive | 2004

Isolierende Harzzusammensetzung und deren Verwendung

Shin Takanezawa; Koji Morita; Takako Watanabe; Toshihisa Kumakura; Hiroyuki Fukai; Hiroaki Fujita

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