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Featured researches published by Tousaku Nishiyama.


IEEE Translation Journal on Magnetics in Japan | 1990

Metal Particulate Medium for Ultra High Density Recording

Masaki Hirokoh; Hiroshi Suzuki; Tousaku Nishiyama; T. Oohata; M. Hasegawa

Metal particulate (MP) test tape was prepared with playback characteristics nearly as good as those of ME tape, using very fine metal particles (average length 0.175¿m) with average axial ratio 9, employing techniques for high dispersion and longitudinal orientation. In essence, these techniques are conventional; however, the test tape boasts superior characteristics making it suitable for use in ultra-high density recording, including a surface roughness of 3.63 nm (Rrms) and a squareness ratio of 0.89. Playback characteristics are also superior: the output level is only 1.5 dB lower than for ME tape at 100 kFRPI. In this paper, we describe the recording density characteristics of this test tape, and demonstrate the effect of an improved squareness ratio and surface roughness on the high-density characteristics, as well as the effect of employing heads with different Bs on the latter characteristics.


Archive | 2000

Printed wiring board and assembly of the same

Tousaku Nishiyama


Archive | 2005

Connection member and mount assembly and production method of the same

Toshiyuki Asahi; Seiji Karashima; Takashi Ichiryu; Seiichi Nakatani; Tousaku Nishiyama; Koichi Hirano; Osamu Shibata; Takeshi Nakayama; Yoshiyuki Saito


Archive | 2003

Semiconductor built-in millimeter-wave band module

Hideki Iwaki; Yutaka Taguchi; Tetsuyosi Ogura; Yasuhiro Sugaya; Toshiyuki Asahi; Tousaku Nishiyama; Yoshinobu Idogawa


Archive | 2007

Method for producing connection member

Toshiyuki Asahi; Seiji Karashima; Takashi Ichiryu; Seiichi Nakatani; Tousaku Nishiyama; Koichi Hirano; Osamu Shibata; Takeshi Nakayama; Yoshiyuki Saito


Archive | 2006

Circuit board with built-in electronic component and method for manufacturing the same

Yukihiro Ishimaru; Tousaku Nishiyama; Yasuhiro Sugaya; Toshiyuki Asahi


Archive | 2004

Wiring board embedded with spherical semiconductor element

Toshiyuki Asahi; Yukihiro Ishimaru; Tousaku Nishiyama; Seiichi Nakatani; Yasuhiro Sugaya


Archive | 2005

Module with a built-in component, and electronic device with the same

Toshiyuki Asahi; Seiji Karashima; Takashi Ichiryu; Seiichi Nakatani; Tousaku Nishiyama


Archive | 2003

Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module

Hideki Iwaki; Yutaka Taguchi; Tetsuyoshi Ogura; Yasuhiro Sugaya; Toshiyuki Asahi; Tousaku Nishiyama; Yoshinobu Idogawa


Archive | 2004

Circuit board with in-built electronic component and method for manufacturing the same

Yukihiro Ishimaru; Tousaku Nishiyama; Yasuhiro Sugaya; Toshiyuki Asahi

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