Troy D. England

Total Dose and Transient Response of SiGe HBTs from a New 4th-Generation, 90 nm SiGe BiCMOS Technology

The total ionizing dose and laser-induced transient response of a new 4th generation 90 nm IBM SiGe 9HP technology are investigated. Total dose testing was performed with 63.3 MeV protons at the Crocker Nuclear Laboratory at the University of California, Davis. Transient testing was performed on the two-photon absorption system at Naval Research Laboratory. Results show that the SiGe HBTs are dose-tolerant up to 3 Mrad(SiO2) and exhibit reduced single event transients compared to earlier SiGe generations.

An 8–16 GHz SiGe Low Noise Amplifier With Performance Tuning Capability for Mitigation of Radiation-Induced Performance Loss

We present a wideband, low noise amplifier (LNA) implemented in a Silicon-Germanium Heterojunction Bipolar Transistor (SiGe HBT) technology. This SiGe LNA covers a frequency range of 8-16 GHz and achieves a peak gain of 17.5 dB at nominal bias and a peak OIP3 of 15.8 dBm at 10 GHz at nominal bias. The noise figure (NF) of the LNA is 4.5-8.1 dB across band, and it nominally consumes 4 mA from a 4 V supply. Samples were irradiated with 63.3 MeV protons to proton-equivalent doses ranging from 200 krad(Si) to 2 Mrad(Si). This LNA incorporates bias control “tuning-knobs” to enable bias tuning to mitigate for RF performance loss due to total dose exposure and process variation in performance metrics. The effectiveness of the tuning “knobs” to compensate for lost post-irradiated performance was investigated. It was found that the LNA performance can be restored with the use of the tuning knobs with a performance tuning algorithm.

A 6–20 GHz Adaptive SiGe Image Reject Mixer for a Self-Healing Receiver

A wideband (6-20 GHz) Silicon-Germanium (SiGe) adaptive image-reject mixer with an intermediate frequency (IF) of 1.8 GHz is presented. The mixer can be “self-healed” to deliver consistent performance by nullifying the effects of process variations, environmental changes, or aging. Various performance metrics of the mixer can also be adapted to different specifications across multiple frequency bands. A conversion gain greater than 15 dB, an image rejection ratio (IRR) exceeding 35 dB, and an output 1-dB compression point greater than 10 dBm, were obtained in measurement. An automated self-healing procedure is developed and shown to be effective for improving the measured performance of the mixer. The mixer was fabricated in a 150 GHz peak fT, 200 nm SiGe BiCMOS process technology and consumes 215 mA of current operating off a 4 V rail.

An Investigation of Single-Event Effects and Potential SEU Mitigation Strategies in Fourth-Generation, 90 nm SiGe BiCMOS

The single-event effect sensitivity of fourth-generation, 90 nm SiGe HBTs is investigated. Inverse-mode, ≥1.0 Gbps SiGe digital logic using standard, unoptimized, fourth-generation SiGe HBTs is demonstrated and the inverse-mode shift register exhibited a reduction in bit-error cross section across all ion-strike LETs. Ion-strike simulations on dc calibrated, 3-D TCAD SiGe HBT models show a reduction in peak current transient magnitude and a reduction in overall transient duration for bulk SiGe HBTs operating in inverse mode. These improvements in device-level SETs are attributed to the electrical isolation of the physical emitter from the subcollector-substrate junction and the high doping in the SiGe HBT base and emitter, suggesting that SiGe BiCMOS technology scaling will drive further improvements in inverse-mode device and circuit-level SEE. Two-photon absorption experiments at NRL support the transient mechanisms described in the device-level TCAD simulations. Fully-coupled mixed-mode simulations predict large improvements in circuit-level SEU for inverse-mode SiGe HBTs in multi-Gbps, inverse-mode digital logic.

A new approach to designing electronic systems for operation in extreme environments: Part II - The SiGe remote electronics unit

We have presented the architecture, simulation, packaging, and over-temperature and radiation testing of a complex, 16-channel, extreme environment capable, SiGe Remote Electronics Unit containing the Remote Sensor Interface ASIC that can serve a wide variety of space-relevant needs as designed. These include future missions to the Moon and Mars, with the additional potential to operate in other hostile environments, including lunar craters and around the Jovian moon, Europa. We have expanded on the previous introduction of the RSI to show the validity of the chip design and performance over an almost 250 K temperature range, down to 100 K, under 100 krad TID radiation exposure, with SEL immunity and operability in a high-flux SET environment.

A new approach to designing electronic systems for operation in extreme environments: Part I - The SiGe Remote Sensor Interface

We have described the modeling, circuit design, system integration, and measurement of a Remote Sensor Interface (Figure 20) that took place over a span of 5 years and 8 fabrication cycles. It was conceived as part of the Multi-Chip Module (MCM) shown in Figure 21, which also includes a digital control chip for clocking, programming, and read-out. Further work beyond the scope of this was performed to validate the RSI for the extreme environmental conditions of a lunar mission, and individual blocks are presently.

Single-Event Transient and Total Dose Response of Precision Voltage Reference Circuits Designed in a 90-nm SiGe BiCMOS Technology

This paper presents an investigation of the impact of single-event transients (SETs) and total ionization dose (TID) on precision voltage reference circuits designed in a fourth-generation, 90-nm SiGe BiCMOS technology. A first-order uncompensated bandgap reference (BGR) circuit is used to benchmark the SET and TID responses of these voltage reference circuits (VRCs). Based on the first-order BGR radiation response, new circuit-level radiation-hardening-by-design (RHBD) techniques are proposed. An RHBD technique using inverse-mode (IM) transistors is demonstrated in a BGR circuit. In addition, a PIN diode VRC is presented as a potential SET and TID tolerant, circuit-level RHBD alternative.

An Investigation of Single-Event Transients in C-SiGe HBT on SOI Current Mirror Circuits

The single-event effect sensitivity of three different commonly employed current mirror circuits, as well as an unconventional inverse-mode current mirror, all implemented in C-SiGe (NPN + PNP) HBT on SOI technology are investigated. Comparisons of the measured data of the basic NPN and PNP current mirror circuits show higher single-event radiation tolerance of PNP SiGe HBTs compared with NPN SiGe HBTs. The concept of utilizing inverse-mode SiGe HBTs in current mirror circuits is investigated. Measurement results validate the feasibility of employing inverse-mode PNP SiGe HBTs in current mirrors and show an excellent resilience against ion-strikes. Full 3-D NanoTCAD models of the SiGe HBTs are developed and used in mixed-mode TCAD simulations (within Cadence) to validate the measurement results. Finally, based on the measurement data and analysis of the four current mirrors, some practical suggestions and observations are offered for operation of such circuits in extreme environments.

Total Ionizing Dose Response of Triple-Well FET-Based Wideband, High-Isolation RF Switches in a 130 nm SiGe BiCMOS Technology

The effects of 63 MeV proton irradiation on the RF performance (insertion loss, isolation, and linearity) of triple-well nFET-based RF switches designed in a 130 nm SiGe BiCMOS technology are investigated. The switches were designed for wide-band operation (1 to 40 GHz) and were required by the application to achieve high isolation (> 35 dB at 40 GHz) with moderate insertion loss (dB at 40 GHz). The RF switch IL improves (S21 increases) at 100 and 500 krad(SiO2), but degrades (S21 decreases) at 2 Mrad(SiO2). P1dB and IIP3 (switch linearity) shows a similar TID response, at 100 and 500 krad(SiO2) dose an increase of ~ 0.4 dBm and ~0.2 dBm, respectively. However, at 2 Mrad(SiO2) both sharply decrease. Standalone RF and dc structures were also irradiated to better understand the underlying mechanisms affecting the switch RF performance. The bias dependence of the radiation-induced change on the measured RF performance of a SPST switch is also analyzed. 10 keV X-ray radiation experiments were conducted on separate dc transistor structures to provide additional insight into the measured impact of total ionization dose on the performance of RF switches.

Evaluating the Effects of Single Event Transients in FET-Based Single-Pole Double-Throw RF Switches

The impact of single event transients (SETs) on single-pole double-throw (SPDT) RF switch circuits designed in a commercially-available, 180 nm second-generation SiGe BiCMOS (IBM 7HP) technology is investigated. The intended application for these SPDT RF switches requires a 1 GHz to 20 GHz band of operation, relatively low insertion loss (<; 3.0 dB at 20 GHz), and moderate isolation (> 15 dB at 20 GHz). Two-photon absorption experiment results reveal that the SPDT switches are vulnerable to SETs due to biasing effects as well as the triple-well (TW) nFETs, which are found to be more sensitive to SETs than bulk nFETs. From these results, potential implications are discussed and mitigation strategies are proposed. To verify one of the proposed mitigation techniques, SPDT switches were also designed in a 180 nm twin-well SOI CMOS (IBM 7RF-SOI) technology. A different biasing technique is implemented to help improve the SET response. The fabricated SOI SPDT switches achieve an insertion loss of <; 1.04 dB at 20 GHz and > 21 dB isolation at 20 GHz. For this circuit, no transients were observed even at very high laser energies (≈ 5 nJ).