Tsvika Kurts

A fully integrated multi-CPU, GPU and memory controller 32nm processor

This paper describes the 32nm Sandy Bridge processor that integrates up to 4 high performance Intel Architecture (IA) cores, a power/performance optimized graphic processing unit (GPU) and memory and PCIe controllers in the same die. The Sandy Bridge architecture block diagram is shown in Fig. 15.1.1 and the floorplan of a four IA-core version is shown in Fig. 15.1.2. The Sandy Bridge IA core implements an improved branch prediction algorithm, a micro-operation (Uop) cache, a floating point Advanced Vector Extension (AVX), a second load port in the L1 cache and bigger register files in the out-of-order part of the machine; all these architecture improvements boost the IA core performance without increasing the thermal power dissipation envelope or the average power consumption (to preserve battery life in mobile systems). The CPUs and GPU share the same 8MB level-3 cache memory. The data flow is optimized by a high performance on die interconnect fabric (called “ring”) that connects between the CPUs, the GPU, the L3 cache and the system agent (SA) unit that houses a 1600MT/s, dual channel DDR3 memory controller, a 20-lane PCIe gen2 controller, a two parallel pipe display engine, the power management control unit and the testability logic. An on die EPROM is used for configurability and yield optimization.

A Fully Integrated Multi-CPU, Processor Graphics, and Memory Controller 32-nm Processor

This paper describes the second-generation Intel Core processor, a 32-nm monolithic die integrating four IA cores, a processor graphics, and a memory controller. Special attention is given to the circuit design challenges associated with this kind of integration. The paper describes the chip floor plan, the power delivery network, energy conservation techniques, the clock generation and distribution, the on-die thermal sensors, and a novel debug port.

The Second Generation Intel® Core™: A highly integrated high performance multi IA-core and processor graphics chip

This paper describes the Second Generation Intel® Core™ processor, a 32nm monolithic die integrating four IA cores, a processor graphics and a memory controller. The die was designed for high performance but without compromising the part power consumption or the part and system cost. To achieve these targets a modular design methodology was devised, this methodology allows fast configuration of the die to achieve the optimal performance/cost/power point for a specific market segment. In this paper some of the techniques used to control the die and package cost are described. Special attention is given to debug-ability hooks that considerably reduce the system time-to-market of this kind of highly integrated processors.