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Dive into the research topics where Tyler L. Brandon is active.

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Featured researches published by Tyler L. Brandon.


Integration | 2008

A scalable LDPC decoder ASIC architecture with bit-serial message exchange

Tyler L. Brandon; Robert Hang; Gary Block; Vincent C. Gaudet; Bruce F. Cockburn; Sheryl L. Howard; Christian Giasson; Keith Boyle; Paul A. Goud; Siavash Sheikh Zeinoddin; Anthony Rapley; Stephen Bates; Duncan G. Elliott; Christian Schlegel

We present a scalable bit-serial architecture for ASIC realizations of low-density parity check (LDPC) decoders. Supporting the architectures potential, we describe a decoder implementation for a (256,128) regular-(3,6) LDPC code that has a decoded information throughput of 250Mbps, a core area of 6.96mm^2 in 180-nm 6-metal CMOS, and an energy efficiency of 7.56nJ per uncoded bit at low signal-to-noise ratios. The decoder is fully block-parallel, with all bits of each 256-bit codeword being processed by 256 variable nodes and 128 parity check nodes that together form an 8-stage iteration pipeline. Extrinsic messages are exchanged bit-serially between the variable and parity check nodes to significantly reduce the interleaver wiring. Parity check node processing is also bit-serial. The silicon implementation performs 32 iterations of the min-sum decoding algorithm on two staggered codewords in the same pipeline. The results of a supplementary layout study show that the reduced wiring congestion makes the decoder readily scaleable up to the longer kilobit-size LDPC codewords that appear in important emerging communication standards.


international symposium on circuits and systems | 2005

Architectures for ASIC implementations of low-density parity-check convolutional encoders and decoders

Ramkrishna Swamy; Stephen Bates; Tyler L. Brandon

Low-density parity-check convolutional codes (LDPC-CCs) are an attractive alternative to their block-oriented counterparts, LDPC-BCs. In this paper, we introduce these codes and propose an encoder and decoder architecture that is implementable as an ASIC. We report upon a realization of this new architecture capable of an information throughput of 430 Mbps and 164 Mbps for the encoder and decoder, respectively. We discuss a top-level chip specification and then extend ideas to parallelize the design.


compound semiconductor integrated circuit symposium | 2007

Design and Test of a 175-Mb/s, Rate-1/2 (128,3,6) Low-Density Parity-Check Convolutional Code Encoder and Decoder

Ramkrishna Swamy; Stephen Bates; Tyler L. Brandon; Bruce F. Cockburn; Duncan G. Elliott; John C. Koob; Zhengang Chen

Low-density parity-check block codes (LDPC-BCs) are quickly becoming the forward error correcting code of choice for emerging communication standards. However, low-density parity-check convolutional codes (LDPC-CCs), the convolutional counterpart of LDPC-BCs, seem to be better suited in applications with streaming data or variable sized packets. A rate-1/2, (128,3,6) LDPC-CC ASIC has been implemented in 180-nm, 1.8-V CMOS technology. We present the VLSI architecture of a register-based LDPC-CC encoder and decoder that includes an on-chip, pseudo-random additive white Gaussian noise channel emulator. The decoder comprises a pipeline of ten identical processing units and attains up to 175 Mb/s of decoded throughput.


IEEE Transactions on Circuits and Systems | 2010

Jointly Designed Architecture-Aware LDPC Convolutional Codes and High-Throughput Parallel Encoders/Decoders

Zhengang Chen; Tyler L. Brandon; Duncan G. Elliott; Stephen Bates; Witold A. Krzymien; Bruce F. Cockburn

A novel design approach is proposed for low-density parity-check convolutional codes (LDPC-CCs), that jointly optimizes the code, encoder and decoder to achieve high-throughput parallel encoding and decoding. A series of implementation-oriented constraints are applied to construct architecture-aware (AA) codes by introducing algebraic structures into the parity-check matrix. The resulting AA codes have bit error rate performance comparable to other published LDPC-CCs. Given these AA LDPC-CCs, new architectures are proposed for a parallel LDPC-CC encoder with built-in termination and an LDPC-CC decoder that is parallel in the node dimension as well as pipelined in the iteration dimension. ASIC synthesis results for a 90-nm CMOS process show that the proposed encoder and the decoding processor achieve 2.0-Gbps throughputs at 250-MHz clock frequencies within silicon areas of 0.1 mm2 and 1 mm2 respectively.


IEEE Transactions on Circuits and Systems | 2009

A Compact 1.1-Gb/s Encoder and a Memory-Based 600-Mb/s Decoder for LDPC Convolutional Codes

Tyler L. Brandon; John C. Koob; L. van den Berg; Zhengang Chen; Amirhossein Alimohammad; R. Swamy; J. Klaus; Stephen Bates; Vincent C. Gaudet; Bruce F. Cockburn; D.G. Elliott

We present a rate-1/2 (128,3,6) LDPC convolutional code encoder and decoder that we implemented in a 90-nm CMOS process. The 1.1-Gb/s encoder is a compact, low-power implementation that includes one-hot encoding for phase generation and built-in termination. The decoder design uses a memory-based interface with a minimum number of memory banks to deliver an information throughput of 1 b per clock cycle. The decoder shares one controller among a pipeline of decoder processors. The decoder dissipates 0.61 nJ of energy per decoded information bit at an SNR of 2 dB and a decoded throughput of 600 Mb/s. On-chip test circuitry permits accurate power measurements to be made at selectable SNR settings.


global communications conference | 2006

CTH08-5: Efficient Encoding and Termination of Low-Density Parity-Check Convolutional Codes

Zhengang Chen; Stephen Bates; Duncan G. Elliott; Tyler L. Brandon

Low-density parity-check convolutional codes (LDPC-CCs) have been shown to have similar capacity-approaching performance to LDPC block codes. Their encoder structure is simple and efficient. However, the encoder termination, which is required when applied to finite length data frames, increases the encoder complexity and reduces the effective code rate. The LDPC-CC encoding and termination problems are discussed in this paper. A novel all-phase termination scheme is proposed with less implementation complexity and less loss in code rate, compared to existing methods. Finally a system architecture for the LDPC-CC encoder with all-phase termination is given with some analyses.


IEEE Transactions on Very Large Scale Integration Systems | 2005

Design of a 3-D fully depleted SOI computational RAM

John C. Koob; Daniel A. Leder; Raymond J. Sung; Tyler L. Brandon; Duncan G. Elliott; Bruce F. Cockburn; Lisa G. McIlrath

We introduce a three-dimensional (3-D) processor-in-memory integrated circuit design that provides progressively increasing processing power as the number of stacked dies increases, while incurring no extra design effort or mask sets. Innovative techniques for processor/memory redundancy and fast global bus evaluation are described. The architecture can be augmented with a nearest-neighbor physical 3-D communications network that can substantially reduce interconnect lengths and relieve routing congestion. The test chip, with 128 Kb of memory and 512 processing elements (PEs) on two fully depleted silicon-on-insulator (SOI) dies, can achieve a peak of 170 billion-bit-operations per second at 400 MHz.


IEEE Transactions on Circuits and Systems | 2008

Efficient Implementation of Low-Density Parity-Check Convolutional Code Encoders With Built-In Termination

Zhengang Chen; Tyler L. Brandon; Stephen Bates; Duncan G. Elliott; Bruce F. Cockburn

Low-density parity-check convolutional codes (LDPC-CCs) have demonstrated comparable error-correcting performance to LDPC block codes (LDPC-BCs). However, the LDPC-CC encoder requires termination when applied to finite-length data frames to ensure that the trailing information bits are fully protected. In this paper, the LDPC-CC encoder design is investigated, and a novel termination scheme is proposed. Starting from any encoder state, the proposed scheme is capable of generating a termination sequence in hardware without padding, thus minimizing the rate loss due to termination. A high-speed architecture for LDPC-CC encoders with built-in termination is proposed. Synthesis results for LDPC-CCs of code memory size up to 512 demonstrate maximum encoding throughputs of around 1 Gb/s for a 90-nm CMOS technology. The implementation cost for such encoders is shown to be reasonably low for average-sized LDPC-CCs.


signal processing systems | 2012

Power Characterization of a Gbit/s FPGA Convolutional LDPC Decoder

Si-Yun J. Li; Tyler L. Brandon; Duncan G. Elliott; Vincent C. Gaudet

In this paper, we present an FPGA implementation of parallel-node low-density-parity-check convolution-code encoder and decoder. A 2.4 Gbit/s rate-1/2 (3, 6) LDPC convolutional-code encoder and decoder were implemented on an Alter a development and education board (DE4). Detailed power measurements of the FPGA board for various configurations of the design have been conducted to characterize the power consumption of the decoder module. For a Eb/N0 of 5 dB, the decoder with 9 processor cores (pipelined decoder iteration stages) has a bit-error-rate performance of 10-10 and achieves an energy-per-coded-bit of 1.683 nJ based on raw power measurement results. The increase in Eb/N0 can effectively reduce the decoder power and energy-per-coded-bit for configurations with 5 or more processor cores for Eb/N0 <; 5 dB. The incremental decoder power cost and incremental energy-per-coded-bit also hold a linearly decreasing trend for each additional processor core.


vlsi test symposium | 2005

Test and characterization of a variable-capacity multilevel DRAM

John C. Koob; Sue Ann Ung; Ashwin S. Rao; Daniel A. Leder; Craig Shannon Joly; Kristopher C. Breen; Tyler L. Brandon; Michael Hume; Bruce F. Cockburn; Duncan G. Elliott

Multilevel DRAM (MLDRAM) increases the storage density of DRAMs by using more than two data signal levels in the storage cells. An operational 19200-cell MLDRAM in 1.8-V 0.18-/spl mu/m mixed-signal CMOS is described that allows 1, 1.5, 2, 2.25 and 2.5 bits-per-cell operation using 2, 3, 4, 5 and 6 data signal levels, respectively. The MLDRAM uses reference and data cell signals that are generated in the cell array using charge sharing. The single-step sensing method uses multiple reference signals in parallel. Test chip characterization features include four cell sizes, two sense amplifier sizes, and bitline shields for half of the cells. New tests were developed based on an MLDRAM fault model. These include basic functionality, retention time, multilevel march, inter-bitline coupling, and cell-plate voltage bump tests. Our results show that the data and reference signals are generated correctly and that MLDRAM is possible for up to six signal levels.

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J. Klaus

University of Alberta

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