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Vassoudevane Lebonheur

Intel

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Publication

Featured researches published by Vassoudevane Lebonheur.

Archive | 2001

Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material

Vassoudevane Lebonheur; Robert Starkston

Archive | 2003

Mold compound cap in a flip chip multi-matrix array package and process of making same

Vassoudevane Lebonheur; Richard J. Harries

Archive | 2001

Method of improving thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material

Vassoudevane Lebonheur; Robert Starkston

Archive | 2004

Vibratable die attachment tool

Terrence Caskey; Vassoudevane Lebonheur

Archive | 2004

No-flow underfill materials for flip chips

Vassoudevane Lebonheur; Terrence Caskey

Archive | 2003

Electronic device with reduced entrapment of material between die and substrate electrical connections

Vassoudevane Lebonheur; Terrence Caskey

Archive | 2005

In Schwingung versetzbares Bausteinbefestigungswerkzeug In vibration transposable module mounting tool

Terrence Caskey; Vassoudevane Lebonheur

Archive | 2005

In vibration transposable element fastening tool

Terrence Caskey; Vassoudevane Lebonheur

Archive | 2004

Preßmassenaufsatz in einem Flip-Chip Multi-Matrix Anordnungspaket und Verfahren zu dessen Herstellung

Richard Chandler Harries; Vassoudevane Lebonheur

Archive | 2004

Preßmassenaufsatz in einem Flip-Chip Multi-Matrix Anordnungspaket und Verfahren zu dessen Herstellung Preßmassenaufsatz in a flip-chip multi-array package and process for its preparation

Vassoudevane Lebonheur; Richard J. Harries

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Collaboration

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Terrence Caskey

Intel

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Richard J. Harries

Intel

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Robert Starkston

Intel

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Richard Chandler Harries

Intel

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