Vernon M. Williams

Standoffs for centralizing internals in packaging process

Method for packaging microelectronic substrates

Reinforced, self-aligning conductive structures for semiconductor device components and methods for fabricating same

Heat sinks including nonlinear passageways

Stereolithographic method for fabricating heat sinks, stereolithographically fabricated heat sinks, and semiconductor devices including same

Stereolithographic methods for securing conductive elements to contacts of semiconductor device components

Stereolithographic methods for fabricating conductive elements

Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components

Programmed material consolidation methods for fabricating heat sinks

Leadframe and method for reducing mold compound adhesion problems