Ford B. Grigg

Thin flip-chip method

Direct die contact (DDC) semiconductor package

Semiconductor device assemblies including interposers with dams protruding therefrom

Methods for manufacturing microelectronic devices and methods for mounting microelectronic packages to circuit boards

Stereolithographically marked semiconductors devices and methods

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

LOC semiconductor assembled with room temperature adhesive

Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad

Thick solder mask for confining encapsulant material over selected location of a substrate and assemblies including the solder mask

Microelectronic devices and methods for mounting microelectronic packages to circuit boards