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Dive into the research topics where Vincent Bley is active.

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Featured researches published by Vincent Bley.


conference of the industrial electronics society | 2006

Industrial and lab-scale power module technologies : A review

Ludovic Ménager; Christian Martin; Bruno Allard; Vincent Bley

In industrial power modules, the most common die-level interconnect technology is wire bonding. In niche markets, where performances such as high power density, high compactness, high switching frequency and good thermal management are required, wire bonds must be removed due to electrical, thermal and mechanical (reliability) limits. 3D packaging technologies are a solution. In this paper, wire bonding technology and 3D packaging technologies are described. A comparison of these technologies is then established from literature data


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2015

Direct Copper Bonding for Power Interconnects: Design, Manufacturing, and Test

Bassem Mouawad; Benoit Thollin; Cyril Buttay; Laurent Dupont; Vincent Bley; Damien Fabrègue; Maher Soueidan; Benoît Schlegel; Julien Pezard; Jean Christophe Crebier

3-D power module structures allow for better cooling and lower parasitic inductances compared with the classical planar technology. In this paper, we present a 3-D technology that uses an innovative assembly method (direct copper-to-copper bonding). The concept and manufacturing process of this technology is described in detail. An accurate electrical characterization is then performed to compare its performance with that of the classical planar structures.


Journal of Applied Physics | 2009

Impact of a surface laser treatment on the dielectric strength of α-alumina

Michael Decup; David Malec; Vincent Bley

The impact of laser treatments on the dielectric strength of α-alumina is investigated. In order to induce low surface modifications to strong damages, different laser processing parameters (fluence, assisting gas and its pressure, and laser wavelength) are applied. The experimental results clearly show that the dielectric strength is not really affected by the laser induced surface modifications. Surface cracks are consequently not considered to be involved in the breakdown mechanism. If any relationship exists between mechanical and dielectric strengths of α-alumina, the assumption considering that the prebreakdown event is the propagation of a mechanical crack from the surface has to be reconsidered.


IEEE Transactions on Power Electronics | 2010

A Lab-Scale Alternative Interconnection Solution of Semiconductor Dice Compatible with Power Modules 3-D Integration

Ludovic Ménager; Maher Soueidan; Bruno Allard; Vincent Bley; Benoît Schlegel

Increase in the power density of power modules requires an interconnection technology alternative to wire-bonding technology. Emerging interconnection technologies allow a 3-D packaging of power modules. A proposal of interconnection solution for the power semiconductor dice is presented here; it is based on copper microposts that are electroplated on topside of the die. The die with its microposts is then attached to a top direct-bonding copper (DBC) substrate using a copper/tin transient liquid phase technique. The assembly of the backside of the die to a bottom DBC substrate is processed concurrently using the same transient liquid phase technique. The benefits or limitations of the substrate on the assembly are not discussed in this letter. Manufacturing and electrical characterization of a power semiconductor die with the microposts interconnection is presented in detail.


IEEE Transactions on Components, Packaging and Manufacturing Technology | 2012

Application of the Spark Plasma Sintering Technique to Low-Temperature Copper Bonding

Bassem Mouawad; Maher Soueidan; Damien Fabrègue; Cyril Buttay; Bruno Allard; Vincent Bley; Hervé Morel; Christian Martin

Planar structures, in which a power die is soldered on a substrate and wirebonds are used to connect the top of the die with the substrate, are limited in terms of thermal management and power density. 3-D packaging techniques have been proposed to overcome these limits. Here, an innovative copper-to-copper bonding solution is presented, that can be used for 3-D packaging. The bonding process is described and the effect of the bonding parameters is investigated. It is found that this technique is compatible with the requirements of power electronic packaging. A test assembly including a silicon power die and ceramic substrates is presented.


conference on electrical insulation and dielectric phenomena | 2005

Investigations on dielectric breakdown of ceramic materials

D. Malec; Vincent Bley; Thierry Lebey

In order to increase the knowledge of the physical mechanism involved during the dielectric breakdown of ceramic material, different experiments are performed. Samples of Al/sub 2/O/sub 3/ with different thicknesses are tested until breakdown occurs. After data analysis, electromechanical mechanism is claimed to be responsible of the observed behaviors. Complementary measurements (electrical and optical) used to confirm this assumption are presented.


electronics system integration technology conference | 2014

Integrated screen printed capacitors in a GaN DC-DC converter allowing double side cooling

Olivier Goualard; Nicolas Videau; Thi Bang Doan; Thierry Lebey; Vincent Bley; Thierry Meynard

Modern power electronics is focused on highly efficient, compact and cost-effective converters. In this paper, gallium nitride (GaN) transistors, multicell topology and integrated capacitors are combined to achieve these objectives. The first results of a 48V-to-5V DC/DC 3-level converter using integrated screen printed capacitors are presented. The power board is designed by assembling a ceramic substrate, with integrated capacitors using a Kapton® film as an insulation layer, and a multilayer PCB substrate for the active components. The integrated screen-printed capacitors technique and the proposed power board assembly allow double side cooling of the power semiconductors.


conference of the industrial electronics society | 2014

Integrated dc-dc based-GaN converter with screen printed capacitors allowing double side cooling

Olivier Goualard; Nicolas Videau; Thierry Meynard; Thi Bang Doan; Thierry Lebey; Vincent Bley; Emmanuel Sarraute

Converter topology, power devices, passives elements and technology are the keys elements to achieve highly efficient and integrated converters. This article discusses each of these items with a point of load converter application in mind. The potential advantages of series connection are discussed: increase of both the specific power and the efficiency, reduction of semiconductors voltage rating and amplitude of the dV/dt, increase of the apparent switching frequency. The aim of this paper is to investigate how the advantages of the versatile Flying Capacitor topology (DC/DC or DC/AC conversion) can be combined with those of gallium nitride (GaN) power transistors. Integrated screen-printed capacitors are also investigated to reduce parasitic elements and allow double side cooling. A 48V to 5V prototype with screen-printed flying capacitors is built to show the feasibility of such a solution.


Journal of Physics: Conference Series | 2013

Soft ferrite cores characterization for integrated micro-inductors

Yen Mai Nguyen; Thomas Lopez; Jean-Pierre Laur; David Bourrier; Samuel Charlot; Zarel Valdez-Nava; Vincent Bley; Céline Combettes; Magali Brunet

Ferrite-based micro-inductors are proposed for hybrid integration on silicon for low-power medium frequency DC-DC converters. Due to their small coercive field and their high resistivity, soft ferrites are good candidates for a magnetic core working at moderate frequencies in the range of 5?10 MHz. We have studied several soft ferrites including commercial ferrite film and U70 and U200 homemade ferrites. The inductors are fabricated at wafer level using micromachining and assembling techniques. The proposed process is based on a sintered ferrite core placed in between thick electroplated copper windings. The low profile ferrite cores of 1.2 ? 2.6 ? 0.2 mm3 are produced by two methods from green tape-casted films and ferrite powder. This paper presents the magnetic characterization of the sintered ferrite films cut and printed in rectangular shape and sintered at different temperatures. The comparison is made in order to find out the best material for the core that can reach the required inductance (470 nH at 6 MHz) under 0.6A current DC bias and that generate the smallest losses. An inductance density of 285 nH/ mm2 up to 6 MHz was obtained for ESL 40011 cores that is much higher than the previously reported devices. The small size of our devices is also a prominent point.


energy conversion congress and exposition | 2009

Planar inductors for high frequency DC-DC converters using microwave magnetic material

Christian Martin; Bruno Allard; Dominique Tournier; Maher Soueidan; Jean Jacques Rousseau; Desire Allessem; Ludovic Ménager; Vincent Bley; Jean-Yves Lembeye

Paper presents simulation and primary experimental results about the fabrication of planar inductances for monolithic DC/DC converters in System-In-Package environment. A microwave magnetic material (YIG) and electroplated copper winding are proposed. A low-cost manufacturing process is proposed that uses dry film instead of UV SU8 resin. Literature details similar manufacturing processes but the proposed magnetic material enables to operate in the 100MHz range. Simulation results based on HFSS and Flux2D simulators present the sensitivity of the inductor to geometrical parameters. Samples have been fabricated for a 1W, Vin=3.6V, Vout=1V converter and a switching frequency above 100MHz. An optimized 25nH inductor with expected 50mΩ RDC, 3mm2 has been designed. Primary results indicate that the nH/(mΩ.mm2) metric is promising and truly comparable to already published results.

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Bassem Mouawad

University of Nottingham

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