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Viren Khandekar

Maxim Integrated

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Publication

Featured researches published by Viren Khandekar.

Archive | 2009

Redistribution layer enhancement to improve reliability of wafer level packaging

S. Kaysar Rahim; Tiao Zhou; Arkadii V. Samoilov; Viren Khandekar; Yong Li Xu

Archive | 2011

Integrated circuit device having extended under ball metallization

Yong Li Xu; Duane Wilcoxen; Yi-Sheng Sun; Viren Khandekar; Arkadii V. Samoilov

Archive | 2011

Three-dimensional chip-to-wafer integration

Amit S. Kelkar; Karthik Thambidurai; Viren Khandekar; Hien D. Nguyen

Archive | 2010

Wafer level packaging with heat dissipation

Viren Khandekar; Arkadii V. Samoilov; Duane Wilcoxen; Ricky Agrawal

Archive | 2012

Wafer-level package device having solder bump assemblies that include an inner pillar structure

Yong L. Xu; Viren Khandekar; Yi-sheng A. Sun; Arkadii V. Samoilov

Archive | 2013

Multi-die, high current wafer level package

Arkadii V. Samoilov; Peter R. Harper; Viren Khandekar; Pirooz Parvarandeh

Archive | 2012

Techniques for wafer-level processing of QFN packages

Viren Khandekar; Karthik Thambidurai; Ahmad Ashrafzadeh; Amit S. Kelkar; Hien D. Nguyen

Archive | 2016

Wafer-level passive device integration

Amit S. Kelkar; Karthik Thambidurai; Peter R. Harper; Viren Khandekar

International Symposium on Microelectronics | 2016

Novel Mold-free Fan-out Wafer Level Package using Silicon Wafer

Amit S. Kelkar; Vivek S. Sridharan; Khanh Tran; Kiyoko Ikeuchi; Anu Srivastava; Viren Khandekar; Ricky Agrawal

Archive | 2014

WAFER-LEVEL CHIP-SCALE PACKAGE DEVICE HAVING BUMP ASSEMBLIES CONFIGURED TO FURNISH SHOCK ABSORBER FUNCTIONALITY

Viren Khandekar; Karthik Thambidurai; Vivek S. Sridharan

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Arkadii V. Samoilov

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Tiao Zhou

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Yong Li Xu

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Amit S. Kelkar

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Karthik Thambidurai

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Duane Wilcoxen

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Hien D. Nguyen

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Kaysar S. Rahim

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Ricky Agrawal

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Peter R. Harper

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