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Peter R. Harper

Texas Instruments

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Publication

Featured researches published by Peter R. Harper.

Archive | 2009

PACKAGED INTEGRATED CIRCUIT HAVING CONFORMAL ELECTROMAGNETIC SHIELDS AND METHODS TO FORM THE SAME

Peter R. Harper

Archive | 2009

INTEGRATED CIRCUIT STACKED PACKAGE PRECURSORS AND STACKED PACKAGED DEVICES AND SYSTEMS THEREFROM

Peter R. Harper; Kenneth J. Maggio

Archive | 2008

Low Inductance Ball Grid Array Device Having Chip Bumps on Substrate Vias

Kenneth Robert Rhyner; Peter R. Harper

Archive | 2008

Bga package with traces for plating pads under the chip

Kenneth Robert Rhyner; Kevin Lyne; David G. Wontor; Peter R. Harper

Archive | 2007

Simplified Substrates for Semiconductor Devices in Package-on-Package Products

Peter R. Harper; James L. Turner; Kevin Lyne; Kurt P. Wachtler

Archive | 2007

Extended plating trace in flip chip solder mask window

Kenneth Robert Rhyner; Peter R. Harper

Archive | 2008

Semiconductor Device Having Wafer Level Chip Scale Packaging Substrate Decoupling

Rajen Murugan; Robert Fabian McCarthy; Baher Haroun; Peter R. Harper

Archive | 2005

Power plane design and jumper wire bond for voltage drop minimization

Stanley Craig Beddingfield; Kevin Lyne; Peter R. Harper

Archive | 2013

Integrated Circuit Packaging With Ball Grid Array Having Differential Pitch To Enhance Thermal Performance

Kenneth Robert Rhyner; Peter R. Harper

Archive | 2007

PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

Rajen Murugan; Peter R. Harper; Mark Gerber

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Collaboration

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Kenneth Robert Rhyner

Texas Instruments

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Kevin Lyne

Texas Instruments

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Rajen Murugan

Texas Instruments

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Baher Haroun

Texas Instruments

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David G. Wontor

Texas Instruments

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James L. Turner

Texas Instruments

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Kenneth J. Maggio

Texas Instruments

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Kurt P. Wachtler

Texas Instruments

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Robert Fabian McCarthy

Texas Instruments

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Stanley Craig Beddingfield

Texas Instruments

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