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Volker Dr. Lehmann

Infineon Technologies

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Publication

Featured researches published by Volker Dr. Lehmann.

Archive | 2002

Detecting biochemical reactions

Thomas Haneder; Alfred Martin; Volker Dr. Lehmann; Thomas Ehben; Hans Christian Dr. Hanke; Karin Fuchs

Archive | 2001

Microtitre plate and coupled multiple pipettor

Volker Dr. Lehmann

Archive | 2006

Chip carrier substrate made if silicon with through-contacts and method for its manufacture

Volker Dr. Lehmann; Florian Binder; Thomas Haneder; Alfred Martin

Archive | 2003

Porous silicon substrate, for chromatography and biomolecule synthesis and filtration, has a primary structure of macro pores and a secondary structure of meso pores in the macro pore side walls

Michaela Fritz; Karin Fuchs; Thomas Haneder; Volker Dr. Lehmann

Archive | 2006

Substrat de support en silicium pour une puce, le substrat ayant des contacts le tranversant procédé pour fabrication

Volker Dr. Lehmann; Florian Binder; Thomas Haneder; Alfred Martin

Archive | 2005

A method for manufacturing a chip carrier substrate of silicon with through contacts

Florian Binder; Thomas Haneder; Volker Dr. Lehmann; Alfred Martin

Archive | 2005

Carrier for assembling microelectronic components and/or integrated circuits e.g. chips, has capacitor electrodes connecting components and circuits, where one electrode is coupled to area of metallization layer or substrate

Florian Binder; Thomas Haneder; Volker Dr. Lehmann; Manfred Schneegans; Grit Sommer

Archive | 2005

Verfahren zur Herstellung eines Chip-Trägersubstrats aus Silizium mit durchgehenden Kontakten A method of manufacturing a chip carrier substrate of silicon with through contacts

Florian Binder; Thomas Haneder; Volker Dr. Lehmann; Alfred Martin

Archive | 2005

Chip-Trägersubstrat aus Silizium mit durchgehenden Kontakten und Herstellungsverfahren dafür Chip carrier substrate of silicon with through contacts, and processes for its preparation

Florian Binder; Thomas Haneder; Volker Dr. Lehmann; Alfred Martin

Archive | 2005

Chip carrier substrate of silicon with through contacts, and manufacturing method thereof

Florian Binder; Thomas Haneder; Volker Dr. Lehmann; Alfred Martin

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Collaboration

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Thomas Haneder

Infineon Technologies

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Alfred Martin

Infineon Technologies

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Florian Binder

Infineon Technologies

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Karin Fuchs

Infineon Technologies

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Michaela Fritz

Infineon Technologies

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Hermann Wendt

Infineon Technologies

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Reinhard Stengl

Siemens

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Stephan Dertinger

Infineon Technologies

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Thomas Ehben

Infineon Technologies

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Gerrit Lange

Infineon Technologies

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