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William J. Rudik

IBM

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Publication

Featured researches published by William J. Rudik.

Archive | 1990

Flame retardant, low dielectric constant microsphere filled laminate

Leroy Newell Chellis; Robert M. Japp; William J. Summa; William J. Rudik; David W. Wang

Archive | 2000

Circuit package having low modulus, conformal mounting pads

Frank J. Downes; Donald S. Farquhar; Robert M. Japp; William J. Rudik

Archive | 1997

Method of forming a flip chip assembly

Jean Dery; Frank D. Egitto; Charles Ouellet; Luc Ouellet; David L. Questad; William J. Rudik; Son K. Tran

Archive | 1996

Electronic device packages having glass free non conductive layers

Bernd Karl-Heinz Appelt; Anilkumar Chinuprasad Bhatt; James W. Fuller; John M. Lauffer; Voya R. Markovich; William J. Rudik; William E. Wilson

Archive | 2001

Method and structure for an organic package with improved BGA life

John U. Knickerbocker; Voya R. Markovich; Thomas R. Miller; William J. Rudik

Archive | 2002

Method for reducing coefficient of thermal expansion in chip attach packages

Lawrence Robert Blumberg; Robert M. Japp; William J. Rudik; John Frank Surowka

Archive | 1987

Multiple wire photosensitive adhesive for wire embedment

William J. Rudik; George P. Schmitt; John F. Shipley

Archive | 1997

Technique for forming resin-impregnated fiberglass sheets using multiple resins

Bernd K. Appelt; Robert M. Japp; Kostantinos Papathomas; William J. Rudik

Archive | 1997

Technique for forming resin-impregnated fiberglass sheets with improved resistance to pinholing

Bernd K. Appelt; Robert M. Japp; Kostantinos Papathomas; William J. Rudik

Archive | 1984

Circuit board including multiple wire photosensitive adhesive

William J. Rudik; George P. Schmitt; John F. Shipley

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Robert M. Japp

IBM

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Voya R. Markovich

IBM

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Thomas R. Miller

IBM

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William E. Wilson

IBM

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Bernd K. Appelt

IBM

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Charles Ouellet

IBM

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David L. Questad

IBM

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Frank D. Egitto

IBM

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George P. Schmitt

IBM

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Gerald Walter Jones

IBM

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