Won-kyoung Choi

FAST: an efficient flash translation layer for flash memory

Flash memory is used at high speed as storage of personal information utilities, ubiquitous computing environments, mobile phones, electronic goods, etc. This is because flash memory has the characteristics of low electronic power, non-volatile storage, high performance, physical stability, portability, and so on. However, differently from hard disks, it has a weak point that overwrites on already written block of flash memory is impossible to be done. In order to make it possible, an erase operation on the written block should be performed before the overwrite, which lowers the performance of flash memory highly. In order to solve this problem, the flash memory controller maintains a system software module called the flash translation layer(FTL). In this paper, we propose an enhanced log block buffer FTL scheme, FAST(Fully Associative Sector Translation), which improves the page usability of each log block by fully associating sectors to be written by overwrites to the entire log blocks. We also show that our FAST scheme outperforms the previous log block buffer scheme.

Electrostatic 1D microscanner with vertical combs for HD resolution display

An electrostatic 1 dimensionally (1D) scanning mirror for HD resolution display is introduced. Vertical comb drive was used to tilt the micro mirror. To minimize the moment of inertia and maximize the tilting angle of the mirror having the diameter of 1.6 mm, the rib was patterned on the backside of the mirror surface and optimized. Via the finite element simulation, the dynamic deformation of 45nm was achieved within the reflecting area in operating resonant mode thanks to the optimized rib structure. The actuating part of scanner was also optimized manipulating with several design variables to get maximum tilting angle. As the fabrication result, mechanical tilting angle of ±12.0 degree was achieved with the resonant frequency of 24.75kHz and the sinusoidal driving voltage of 280Vpp. For stable resonant motion of the scanner, the feedback control algorithm was realized in the driving circuit. Rigorous reliability characterization was carried out using statistical analysis on the fabricated samples. As a result, HD-resolution image with 720 progressive horizontal lines was demonstrated.

Eye-type scanning mirror with dual vertical combs for laser display

Since lasers have the most saturated colors, laser display can express the natural color excellently. Laser scanning display has merits of simple structure and high optical efficiency. We designed a new scanning mirror which has a circular mirror plate with an elliptical outer frame and is electrostatically driven by vertical combs arranged at the outer frame. This eye-type mirror showed a larger deflection angle compared to the rectangular and the elliptical mirrors. To increase the driving force twice, stationary comb electrodes are arranged at the upper and lower sides of the moving comb fingers, together. The diameter of the mirror plate is 1.0 mm, and the lengths of the major and minor axes of the outer frame are 2.5 mm and 1.0 mm, respectively. Using this scanning mirror, we obtained an optical scanning angle of 32 degrees when driven by the ac control voltage of the resonant frequency in the range of 22.1 ~ 24.5 kHz with the 100 V dc bias voltages. We demonstrated the full color XGA-resolution video image with the size over 30 inches using an eye-type scanning mirror. The successful development of compact laser TV will open a new area of home application of the laser light.

Flip-Chip Bonding of MEMS Scanner for Laser Display Using Electroplated AuSn Solder Bump

A MEMS scanner has been flip-chip bonded by using electroplated AuSn solder bumps. The microelectromechanical systems (MEMS) scanner is mainly composed of two structures having vertical comb fingers. To optimize the bonding condition, the MEMS scanner was flip-chip bonded with various bonding temperatures. Scanning electron microscopy (SEM) with an energy dispersive X-ray (EDX) spectroscopic system was used to observe the microstructures of the joints and analyze the element compositions of them. The die shear strength increased as the bonding temperature increased. During the thermal aging test, the delamination occurred at the interconnection of the MEMS scanner bonded at 340 degC. It is inferred that the Au layer serving as pad metallization has been dissolved in the molten AuSn solder totally, and subsequently the Cr layer was directly exposed to the AuSn solder. Judging by the results of both die shear test and thermal aging test, the optimal bonding temperature was found to be approximately 320 degC. Finally, using this MEMS scanner, we obtained an optical scanning angle of 32deg when driven by the ac control voltage of the resonant frequency in the range of 22.1-24.5 kHz with the 100-V dc bias voltages