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Wu Chi-Hsi

TSMC

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Publication

Featured researches published by Wu Chi-Hsi.

Archive | 2017

DUMMY FEATURES IN REDISTRIBUTION LAYERS (RDLS) AND METHODS OF FORMING SAME

Hsieh Cheng-Hsien; Hsu Li-Han; Wu Wei-Cheng; Chen Hsien-Wei; Yeh Der-Chyang; Wu Chi-Hsi; Yu Chen-Hua

Archive | 2014

Integrated circuit device and fabrications thereof

Li Hou-Ju; Lai Kao-Ting; Ting Kuo-Chiang; Wu Chi-Hsi

Archive | 2017

Structure and Method of Forming a Joint Assembly

Chen Ying-Ju; Su An-Jhih; Chen Hsien-Wei; Yeh Der-Chyang; Wu Chi-Hsi; Yu Chen-Hua

Archive | 2017

Semiconductor device, semiconductor package and manufacturing method thereof

Hsieh Cheng-Hsien; Hsu Li-Han; Wu Wei-Cheng; Chen Hsien-Wei; Yeh Der-Chyang; Wu Chi-Hsi; Yu Chen-Hua

Archive | 2017

HILFSMETALL MIT ZICKZACKFÖRMIGEN RÄNDERN

Hsieh Cheng-Hsien; Chen Hsien-Wei; Yu Chen-Hua; Yeh Der-Chyang; Wu Wei-Cheng; Hsu Li-Han; Wu Chi-Hsi

Archive | 2017

Struktur und Bildungsverfahren für Chippaket

Wei Wen-Hsin; Wu Chi-Hsi; Yu Chen-Hua; Hu Hsien-Pin; Chen Wei-Ming; Hou Shang-Yun

Archive | 2017

SMD/IPD auf Gehäuse oder Vorrichtungsstruktur und Verfahren zu Ihrer Ausbildung

Hsieh Cheng-Hsien; Chen Hsien-Wei; Yu Chen-Hua; Wu Wei-Cheng; Yeh Der-Chyang; Wu Chi-Hsi

Archive | 2017

ÖFFNUNG IM PAD ZUM BONDEN EINER INTEGRIERTEN PASSIVEN VORRICHTUNG IN EIN INFO-PACKAGE

Hsu Li-Han; Wu Wei-Cheng; Chen Hsien-Wei; Wu Chi-Hsi; Yu Chen-Hua; Hsieh Cheng-Hsien; Yeh Der-Chyang

Archive | 2017

Opening in the Pad for Bonding Integrated Passive Device in InFO Package

Hsieh Cheng-Hsien; Wu Chi-Hsi; Yu Chen-Hua; Yeh Der-Chyang; Chen Hsien-Wei; Hsu Li-Han; Wu Wei-Cheng

Archive | 2016

Chip Package Having Die Structures of Different Heights and Method of Forming Same

Wei Wen-Hsin; Wu Chi-Hsi; Yu Chen-Hua; Hu Hsien-Pin; Hou Shang-Yun; Chen Wei-Ming

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Collaboration

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Yu Chen-Hua

TSMC

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Chen Hsien-Wei

TSMC

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Yeh Der-Chyang

TSMC

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Hsieh Cheng-Hsien

TSMC

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Wu Wei-Cheng

TSMC

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Hsu Li-Han

TSMC

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Chen Wei-Ming

TSMC

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Hou Shang-Yun

TSMC

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Hu Hsien-Pin

TSMC

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Su An-Jhih

TSMC

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