Xingcheng Xiao

Low temperature growth of ultrananocrystalline diamond

Ultrananocrystalline diamond (UNCD) films were prepared by microwave plasma chemical vapor deposition using argon-rich Ar∕CH4 plasmas at substrate temperatures from ∼400 to 800°C. Different seeding processes were employed to enhance the initial nucleation density for UNCD growth to about 1011sites∕cm2. High-resolution transmission electron microscopy, near-edge x-ray absorption fine structure, visible and ultraviolet Raman spectroscopy, and scanning electron microscopy were used to study the bonding structure as a function of growth temperature. The results showed that the growth of UNCD films is much less dependent on substrate temperature than for hydrogen-based CH4∕H2 plasmas. UNCD with nearly the same nanoscale structure as those characteristic of high-temperature deposition can be grown at temperatures as low as 400°C with growth rates of about 0.2μm∕hr. The average grain size increased to about 8nm from 3 to 5nm that is characteristic of high-temperature growth, but the relative amounts of sp3 and s...

Materials science and fabrication processes for a new MEMS technology based on ultrananocrystalline diamond thin films

Most MEMS devices are currently based on silicon because of the available surface machining technology. However, Si has poor mechanical and tribological properties which makes it difficult to produce high performance Si based MEMS devices that could work reliably, particularly in harsh environments; diamond, as a superhard material with high mechanical strength, exceptional chemical inertness, outstanding thermal stability and superior tribological performance, could be an ideal material for MEMS. A key challenge for diamond MEMS is the integration of diamond films with other materials. Conventional CVD thin film deposition methods produce diamond films with large grains, high internal stress, poor intergranular adhesion and very rough surfaces, and are consequently ill-suited for MEMS applications. Diamond-like films offer an alternative, but are deposited using physical vapour deposition methods unsuitable for conformal deposition on high aspect ratio features, and generally they do not exhibit the outstanding mechanical properties of diamond. We describe a new ultrananocrystalline diamond (UNCD) film technology based on a microwave plasma technique using argon plasma chemistries that produce UNCD films with morphological and mechanical properties that are ideally suited for producing reliable MEMS devices. We have developed lithographic techniques for the fabrication of UNCD MEMS components, including cantilevers and multilevel devices, acting as precursors to micro-bearings and gears, making UNCD a promising material for the development of high performance MEMS devices. We also review the mechanical, tribological, electronic transport, chemical and biocompatibility properties of UNCD, which make this an ideal material for reliable, long endurance MEMS device use.

Thermal transport and grain boundary conductance in ultrananocrystalline diamond thin films

Although diamond has the highest known room temperature thermal conductivity, k∼2200W∕mK, highly sp3 amorphous carbon films have k<15W∕mK. We carry out an integrated experimental and simulation study of thermal transport in ultrananocrystalline diamond (UNCD) films. The experiments show that UNCD films with a grain size of 3–5nm have thermal conductivities as high as k=12W∕mK at room temperature, comparable with that of the most conductive amorphous diamond films. This value corresponds to a grain boundary (Kapitza) conductance greater than 3000MW∕m2K, which is ten times larger than that previously seen in any material. Our simulations of both UNCD and individual diamond grain boundaries yield values for the grain boundary conductance consistent with the experimentally obtained value, leading us to conclude that thermal transport in UNCD is controlled by the intrinsic properties of the grain boundaries.

Elasticity, strength, and toughness of single crystal silicon carbide, ultrananocrystalline diamond, and hydrogen-free tetrahedral amorphous carbon

In this work, the authors report the mechanical properties of three emerging materials in thin film form: single crystal silicon carbide (3C-SiC), ultrananocrystalline diamond, and hydrogen-free tetrahedral amorphous carbon. The materials are being employed in micro- and nanoelectromechanical systems. Several reports addressed some of the mechanical properties of these materials but they are based in different experimental approaches. Here, they use a single testing method, the membrane deflection experiment, to compare these materials’ Young’s moduli, characteristic strengths, fracture toughnesses, and theoretical strengths. Furthermore, they analyze the applicability of Weibull theory [Proc. Royal Swedish Inst. Eng. Res. 153, 1 (1939); ASME J. Appl. Mech. 18, 293 (1951)] in the prediction of these materials’ failure and document the volume- or surface-initiated failure modes by fractographic analysis. The findings are of particular relevance to the selection of micro- and nanoelectromechanical systems m...

Dielectric properties of hydrogen-incorporated chemical vapor deposited diamond thin films

Diamond thin films with a broad range of microstructures from a ultrananocrystalline diamond (UNCD) form developed at Argonne National Laboratory to a microcrystalline diamond (MCD) form have been grown with different hydrogen percentages in the Ar∕CH4 gas mixture used in the microwave plasma enhanced chemical vapor deposition (CVD) process. The dielectric properties of the CVD diamond thin films have been studied using impedance and dc measurements on metal-diamond-metal test structures. Close correlations have been observed between the hydrogen content in the bulk of the diamond films, measured by elastic recoil detection (ERD), and their electrical conductivity and capacitance-frequency (C-f) behaviors. Addition of hydrogen gas in the Ar∕CH4 gas mixture used to grow the diamond films appears to have two main effects depending on the film microstructure, namely, (a) in the UNCD films, hydrogen incorporates into the atomically abrupt grain boundaries satisfying sp2 carbon dangling bonds, resulting in inc...

Mechanical Properties of Ultrananocrystalline Diamond Thin Films for MEMS Applications

Microcantilever deflection and the membrane deflection experiment (MDE) were used to examine the elastic and fracture properties of ultrananocrystalline diamond (UNCD) thin films in relation to their application to microelectromechanical systems (MEMS). Freestanding microcantilevers and membranes were fabricated using standard MEMS fabrication techniques adapted to our UNCD film technology. Elastic moduli measured by both methods described above are in agreement, with the values being in the range 930 and 970 GPa with both techniques showing good reproducibility. The MDE test showed fracture strength to vary from 3.95 to 5.03 GPa when seeding was performed with ultrasonic agitation of nanosized particles.

Electron paramagnetic resonance study of hydrogen-incorporated ultrananocrystalline diamond thin films.

Hydrogen-incorporated ultrananocrystalline diamond (UNCD) thin films have been deposited in microwave plasma enhanced chemical vapor deposition (MPECVD) system with various hydrogen concentrations in the Ar/CH4 gas mixture, and characterized by several techniques including electron paramagnetic resonance (EPR), Raman spectroscopy, scanning electron microscope (SEM), and dc conductivity measurements. The EPR spectrum of diamond film was composed of two Lorentzian lines with different g factors. When hydrogen concentration in the plasma increased during diamond growth, the spin density of the narrow line decreased, whereas the spin density of the broad signal remained roughly constant. We propose that the two EPR components can be attributed to two different phases in the diamond film, i.e., the narrow line is originated from the highly defective grain boundary region and the broad line is related to the defects in the diamond grains.