Yasuo Kamigata
Hitachi
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Publication
Featured researches published by Yasuo Kamigata.
MRS Proceedings | 2002
Jin Amanokura; Yasuo Kamigata; Masanobu Habiro; Hiroshi Suzuki; Masanobu Hanazono
Abrasive-free Cu CMP solutions have been developed to reduce micro-scratches and obtain minimized dishing and erosion properties. During the development of the solutions, some electrochemical examinations were performed. One of the most instructive knowledge was obtained through the Tafel plot. Other attractive data were obtained through Cu complex film analysis. On the basis of these studies were developed and released newly formulated abrasive-free Cu CMP solutions with a high Cu removal rate and excellent topography performance. Mechanism of polishing by applying abrasive-free Cu CMP solutions is also discussed in this paper.
Archive | 2003
Yasushi Kurata; Hiroshi Ono; Yasuo Kamigata; Kazuhiro Enomoto
Archive | 2007
Yasushi Kurata; Hiroshi Ono; Yasuo Kamigata; Kazuhiro Enomoto
Archive | 2006
Takeshi Uchida; Tetsuya Hoshino; Hiroki Terazaki; Yasuo Kamigata; Naoyuki Koyama; Yoshio Honma; Seiichi Kondoh
Archive | 1999
Takeshi Uchida; Jun Matsuzawa; Tetsuya Hoshino; Yasuo Kamigata; Hiroki Terazaki; Yoshio Honma; Seiichi Kondoh
Archive | 1994
Yasuo Kamigata; Takeshi Yoshida; Kenzo Susa; Tatsuya Uchida; Hatsue Hiratsuka
Archive | 2000
Takeshi Uchida; Yasuo Kamigata; Hiroki Terasaki; Yasushi Kurata; Tetsuya Hoshino; Akiko Igarashi
Archive | 2003
Yasushi Kurata; Yasuo Kamigata; Sou Anzai; Hiroki Terazaki
Archive | 1994
Tatsuya Uchida; Hatsue Hiratsuka; Yasuo Kamigata; Takeshi Yoshida; Hidefumi Tsuboi
Archive | 2006
Yasushi Kurata; Yasuo Kamigata; Takeshi Uchida; Hiroki Terasaki; Akiko Igarashi
