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Dive into the research topics where Yehea I. Ismail is active.

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Featured researches published by Yehea I. Ismail.


IEEE Transactions on Very Large Scale Integration Systems | 2000

Effects of inductance on the propagation delay and repeater insertion in VLSI circuits

Yehea I. Ismail; Eby G. Friedman

A closed-form expression for the propagation delay of a CMOS gate driving a distributed RLC line is introduced that is within 5% of dynamic circuit simulations for a wide range of RLC loads. It is shown that the error in the propagation delay if inductance is neglected and the interconnect is treated as a distributed RC line can be over 35% for current on-chip interconnect. It is also shown that the traditional quadratic dependence of the propagation delay on the length of the interconnect for RC lines approaches a linear dependence as inductance effects increase. On-chip inductance is therefore expected to have a profound effect on traditional high-performance integrated circuit (IC) design methodologies. The closed-form delay model is applied to the problem of repeater insertion in RLC interconnect. Closed-form solutions are presented for inserting repeaters into RLC lines that are highly accurate with respect to numerical solutions. RC models can create errors of up to 30% in the total propagation delay of a repeater system as compared to the optimal delay if inductance is considered. The error between the RC and RLC models increases as the gate parasitic impedances decrease with technology scaling. Thus, the importance of inductance in high-performance very large scale integration (VLSI) design methodologies will increase as technologies scale.


IEEE Transactions on Very Large Scale Integration Systems | 1999

Figures of merit to characterize the importance of on-chip inductance

Yehea I. Ismail; Eby G. Friedman; José Luis Neves

A closed-form solution for the output signal of a CMOS inverter driving an RLC transmission line is presented. This solution is based on the alpha power law for deep submicrometer technologies. Two figures of merit are presented that are useful for determining if a section of interconnect should be modeled as either an RLC or an RC impedance. The damping factor of a lumped RLC circuit is shown to be a useful criterion. The second useful figure of merit considered in this paper is the ratio of the rise time of the input signal at the driver of an interconnect line to the time of flight of the signals across the line. AS/X circuit simulations of an RLC transmission line and a five section RC II circuit based on a 0.25-/spl mu/m IBM CMOS technology are used to quantify and determine the relative accuracy of an RC model. One primary result of this paper is evidence demonstrating that a range for the length of the interconnect exists for which inductance effects are prominent. Furthermore, it is shown that under certain conditions, inductance effects are negligible despite the length of the section of interconnect.


IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems | 2000

Equivalent Elmore delay for RLC trees

Yehea I. Ismail; Eby G. Friedman; José Luis Neves

Closed-form solutions for the 50% delay, rise time, overshoots, and settling time of signals in an RLC tree are presented. These solutions have the same accuracy characteristics of the Elmore delay for RC trees and preserves the simplicity and recursive characteristics of the Elmore delay. Specifically, the complexity of calculating the time domain responses at all the nodes of an RLC tree is linearly proportional to the number of branches in the tree and the solutions are always stable. The closed-form expressions introduced here consider all damping conditions of an RLC circuit including the underdamped response, which is not considered by the Elmore delay due to the nonmonotone nature of the response. The continuous analytical nature of the solutions makes these expressions suitable for design methodologies and optimization techniques. Also, the solutions have significantly improved accuracy as compared to the Elmore delay for an overdamped response. The solutions introduced here for RLC trees can be practically used for the same purposes that the Elmore delay is used for RC trees.


design automation conference | 2005

Statistical static timing analysis: how simple can we get?

Chirayu S. Amin; Noel Menezes; Kip Killpack; Florentin Dartu; Umakanta Choudhury; Nagib Hakim; Yehea I. Ismail

With an increasing trend in the variation of the primary parameters affecting circuit performance, the need for statistical static timing analysis (SSTA) has been firmly established in the last few years. While it is generally accepted that a timing analysis tool should handle parameter variations, the benefits of advanced SSTA algorithms are still questioned by the designer community because of their significant impact on complexity of STA flows. In this paper, we present convincing evidence that a path-based SSTA approach implemented as a post-processing step captures the effect of parameter variations on circuit performance fairly accurately. On a microprocessor block implemented in 90nm technology, the error in estimating the standard deviation of the timing margin at the inputs of sequential elements is at most 0.066 FO4 delays, which translates in to only 0.31% of worst case path delay.


Archive | 2001

On-chip inductance in high speed integrated circuits

Yehea I. Ismail; Eby G. Friedman

List of Figures. List of Tables. Preface. 1. Introduction. 2. Basic Transmission Line Theory. 3. Evaluating the Transient Response of Linear Networks. 4. Mosfet Current-Voltage Characteristics. 5. Figures of Merit to Characterize the Importance of on-Chip Inductance in Single Lines. 6. Effects of Inductance on the Propagation Delay and Repeater Insertion Process in RLC Lines. 7. Equivalent Elmore Delay for RLC Trees. 8. Characterizing Inductance Effects in RLC Trees. 9. Repeater Insertion in Tree Structured Inductive Interconnect. 10. Dynamic and Short-Circuit Power of CMOS Gates Driving Lossless Transmission Lines. 11. Exploiting On-Chip Inductance in High Speed Clock Distribution Networks. 12. Accurate and Efficient Evaluation of the Transient Response in RLC Circuits: The DTT Method. 13. On the Extraction of On-Chip Inductance. 14. Conclusions. Bibliography. Appendices. Index. About the Authors.


IEEE Transactions on Very Large Scale Integration Systems | 2008

Accurate Estimation of SRAM Dynamic Stability

DiaaEldin Khalil; Muhammad M. Khellah; Nam Sung Kim; Yehea I. Ismail; Tanay Karnik; Vivek De

In this paper, an accurate approach for estimating SRAM dynamic stability is proposed. The conventional methods of SRAM stability estimation suffer from two major drawbacks: 1) using static failure criteria, such as static noise margin (SNM), which does not capture the transient and dynamic behavior of SRAM operation and 2) using quasi-Monte Carlo simulation, which approximates the failure distribution, resulting in large errors at the tails where the desired failure probabilities exist. These drawbacks are eliminated by employing a new distribution-independent, most-probable-failure-point search technique for accurate probability calculation along with accurate simulation-based dynamic failure criteria. Compared to previously published techniques, the proposed technique offers orders of magnitude improvement in accuracy. Furthermore, the proposed technique enables the correct evaluation of stability in real operation conditions and for different dynamic circuit techniques, such as dynamic write-back, where the conventional methods are not applicable.


IEEE Transactions on Very Large Scale Integration Systems | 2004

Modeling skin and proximity effects with reduced realizable RL circuits

Shizhong Mei; Yehea I. Ismail

On-chip conductors such as clock- and power-distribution networks require accurately modeling skin and proximity effects. Furthermore, to incorporate skin and proximity effects in the existing generic simulation tools such as SPICE, simple-frequency independent-lumped element-circuit models are needed. A rule based RL circuit model is proposed in this paper that is realizable and predicts skin and proximity effects accurately in the frequency range of interest. With this circuit model, wires are characterized by a few parallel branches of resistors and inductors while proximity effect is captured by mutual inductance between inductors in different RL circuits.


international conference on computer aided design | 2002

Efficient model order reduction via multi-node moment matching

Yehea I. Ismail

The new concept of Multi-node Moment Matching (MMM) is introduced in this paper. The MMM technique simultaneously matches the moments at several nodes of a circuit using explicit moment matching around s=0. As compared to the well-known Single-point Moment Matching (SMM) techniques (such as AWE), MMM has several advantages. First, the number of moments required by MMM is significantly lower than SMM for a reduced order model of the same accuracy, which directly translates into computational efficiency. This higher computational efficiency of MMM as compared to SMM increases with the number of inputs to the circuit. Second, MMM has much better numerical stability as compared to SMM. This characteristic allows MMM to calculate an arbitrarily high order approximation of a linear system, achieving the required accuracy for systems with complex responses. Finally, MMM is highly suitable for parallel processing techniques especially for higher order approximations while SMM has to calculate the moments sequentially and cannot be adapted to parallel processing techniques.


IEEE Transactions on Very Large Scale Integration Systems | 2001

Exploiting the on-chip inductance in high-speed clock distribution networks

Yehea I. Ismail; Eby G. Friedman; José Luis Neves

On-chip inductance effects can be used to improve the performance of high-speed integrated circuits. Specifically, inductance improves the signal slew rate (the rise time), virtually eliminates short-circuit power consumption and reduces the area of the active devices and repeaters inserted to optimize the performance of long interconnects. These positive effects suggest the development of design strategies that benefit from on-chip inductance. An example of a clock distribution network is presented to illustrate the process in which inductance can be used to improve the performance of high-speed integrated circuits.


international conference on computer aided design | 2003

Weibull Based Analytical Waveform Model

Chirayu S. Amin; Florentin Dartu; Yehea I. Ismail

Current CMOS technologies are characterized by interconnectlines with increased relative resistance w.r.t. driver outputresistance. Designs generate signal waveshapes that are verydifficult to model using a single parameter model such as thetransition time. In this paper, we present a simple and robustparameter analytical expression for waveform modeling based onthe Weibull cumulative distribution function. The Weibull modelaccurately captures the variety of waveshapes without introducingsignificant runtime overhead and produces results with less than5% error. We also present a fast and simple algorithm to convertwaveforms obtained by circuit simulation to the Weibull model. Amethodology for characterizing gates for the new model is alsopresented. Simulation results for many single and multiple inputgates show errors well below 5%. Our model can be used in amixed environment where some signals may still be characterizedby a single parameter.

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Mohamed A. Swillam

American University in Cairo

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