Yong-hwan Kwon

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Method for manufacturing tape wiring board

Method of manufacturing tape wiring substrate

Package and method for bonding between gold lead and gold bump

Bump formed on semiconductor device chip and method for manufacturing the bump

SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME

Bump structure for a semiconductor device and method of manufacture

Method of manufacturing a semiconductor device having an even coating thickness and related device

Film substrate of a semiconductor package and a manufacturing method

Semiconductor device, e.g. liquid crystal display driver integrated circuit package, includes bump structures having width greater than pitch gap between successively arrayed bump structures, and having non-conductive sidewall