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Yong-hwan Kwon

Samsung

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Publication

Featured researches published by Yong-hwan Kwon.

Archive | 2004

Method of forming redistribution bump and semiconductor chip and mount structure fabricated using the same

Yong-hwan Kwon; Sa-Yoon Kang; Chung-Sun Lee

Archive | 2005

Method for manufacturing tape wiring board

Kyoung-sei Choi; Sa-Yoon Kang; Yong-hwan Kwon; Chung-Sun Lee

Archive | 2005

Method of manufacturing tape wiring substrate

Chung-Sun Lee; Sa-Yoon Kang; Yong-hwan Kwon; Kyoung-sei Choi

Archive | 2004

Package and method for bonding between gold lead and gold bump

Si-Hoon Lee; Sa-Yoon Kang; Dong-Han Kim; Yong-hwan Kwon; Chung-Sun Lee

Archive | 2004

Bump formed on semiconductor device chip and method for manufacturing the bump

Yong-hwan Kwon; Sa-Yoon Kang

Archive | 2006

SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME

Chung-Sun Lee; Yong-hwan Kwon; Kyoung-sei Choi; Woon-Byung Kang

Archive | 2009

Bump structure for a semiconductor device and method of manufacture

Yong-hwan Kwon; Chung-Sun Lee; Sa-Yoon Kang

Archive | 2011

Method of manufacturing a semiconductor device having an even coating thickness and related device

Woon-Seong Kwon; Chung-Sun Lee; Yong-hwan Kwon; Un-Byoung Kang; Hyung-Sun Jang

Archive | 2005

Film substrate of a semiconductor package and a manufacturing method

Chung-Sun Lee; Yong-hwan Kwon; Sa-Yoon Kang; Kyoung-sei Choi

Archive | 2005

Semiconductor device, e.g. liquid crystal display driver integrated circuit package, includes bump structures having width greater than pitch gap between successively arrayed bump structures, and having non-conductive sidewall

Yong-hwan Kwon; Chung-Sun Lee; Sa-Yoon Kang

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Collaboration

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Chung-Sun Lee

Samsung

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Sa-Yoon Kang

Samsung

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Kyoung-sei Choi

Samsung

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Dong-Han Kim

Samsung

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Hyung-Sun Jang

Samsung

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Si-Hoon Lee

Samsung

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Un-Byoung Kang

Samsung

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Woon-Byung Kang

Samsung

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Woon-Seong Kwon

Samsung

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