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Woon-Seong Kwon

Xilinx

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Publication

Featured researches published by Woon-Seong Kwon.

International Symposium on Microelectronics | 2013

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Woon-Seong Kwon; Myongseob Kim; Jonathan Chang; Suresh Ramalingam; Liam Madden; Genie Tsai; Stephen Tseng; J. Y. Lai; Terren Lu; Steve Chiu

International Symposium on Microelectronics | 2014

Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)

Woon-Seong Kwon; Suresh Ramalingam; Xin Wu; Liam Madden; C. Y. Huang; Hung-Hsien Chang; Chi-Hsin Chiu; Steve Chiu; Stephen Chen

Archive | 2013

SUBSTRATE-LESS INTERPOSER TECHNOLOGY FOR A STACKED SILICON INTERCONNECT TECHNOLOGY (SSIT) PRODUCT

Woon-Seong Kwon; Suresh Ramalingam; Namhoon Kim; Joong-Ho Kim

Archive | 2012

Methods for flip chip stacking

Woon-Seong Kwon; Suresh Ramalingam

Archive | 2015

MULTI-CHIP SILICON SUBSTRATE-LESS CHIP PACKAGING

Woon-Seong Kwon; Suresh Ramalingam

Archive | 2013

Warpage management for fan-out mold packaged integrated circuit

Woon-Seong Kwon; Suresh Ramalingam; Paul Y. Wu; Manoj Nachnani

Archive | 2015

Semiconductor assembly having bridge module for die-to-die interconnection

Woon-Seong Kwon; Suresh Ramalingam

Archive | 2013

Multi-die integrated circuits implemented using spacer dies

Woon-Seong Kwon; Suresh Ramalingam

Archive | 2017

Interposer with edge reinforcement and method for manufacturing same

Woon-Seong Kwon; Suresh Ramalingam

Archive | 2016

Integrated circuit package with multi-trench structure on flipped substrate contacting underfill

Woon-Seong Kwon; Suresh Ramalingam

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Collaboration

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Suresh Ramalingam

Xilinx

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Joong-Ho Kim

Xilinx

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Liam Madden

Xilinx

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Namhoon Kim

Xilinx

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Paul Y. Wu

Xilinx

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Dennis C.P. Leung

Xilinx

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Jonathan Chang

Xilinx

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Myongseob Kim

Xilinx

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Xin Wu

Xilinx

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Manoj Nachnani

Xilinx

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