Woon-Seong Kwon

Enabling a Manufacturable 3D Technologies and Ecosystem using 28nm FPGA with Stack Silicon Interconnect Technology

Cost Effective and High Performance 28nm FPGA with New Disruptive Silicon-Less Interconnect Technology (SLIT)

SUBSTRATE-LESS INTERPOSER TECHNOLOGY FOR A STACKED SILICON INTERCONNECT TECHNOLOGY (SSIT) PRODUCT

Methods for flip chip stacking

MULTI-CHIP SILICON SUBSTRATE-LESS CHIP PACKAGING

Warpage management for fan-out mold packaged integrated circuit

Semiconductor assembly having bridge module for die-to-die interconnection

Multi-die integrated circuits implemented using spacer dies

Interposer with edge reinforcement and method for manufacturing same

Integrated circuit package with multi-trench structure on flipped substrate contacting underfill