Yoshifumi Takata

Multilayer interconnection structure for a semiconductor device

Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same

Semiconductor device having improved interconnection-wiring structures

Semiconductor device and method for fabricating the same and apparatus for chemical mechanical polishing and method of chemical mechanical polishing

Method for manufacturing a multilayer wiring structure employing metal fillets at step portions

Method of making an interconnection structure of a semiconductor device

Semiconductor device having capacitive element and manufacturing method thereof

Manufacturing method of semiconductor device having capacitive element

Semiconductor device having an improved interlayer conductor connections and a manufacturing method thereof

Connection structure for semiconductor component - has aluminium@ compound laminate contg. aluminium@ alloy and refractory metal layers covered by insulating layer