Junko Izumitani

Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same

Inspection data analyzing apparatus for in-line inspection with enhanced display of inspection results

Semiconductor device and method for fabricating the same and apparatus for chemical mechanical polishing and method of chemical mechanical polishing

Inspection data analyzing/processing system for inline inspection

Semiconductor device having capacitive element and manufacturing method thereof

Manufacturing method of semiconductor device having capacitive element

Semiconductor device and apparatus and method for manufacturing the same

Semiconductor device has opening with bottom defined by bonding pad connected to interconnection layer made of aluminum alloy, is formed on insulating films and buffer coat film

Contact structure, semiconductor device and manufacturing method thereof

Semiconductor device, method of manufacturing the same, contact structure, and method of forming the same