Young-soo Park

Electrical manipulation of nanofilaments in transition-metal oxides for resistance-based memory.

The fabrication of controlled nanostructures such as quantum dots, nanotubes, nanowires, and nanopillars has progressed rapidly over the past 10 years. However, both bottom-up and top-down methods to integrate the nanostructures are met with several challenges. For practical applications with the high level of the integration, an approach that can fabricate the required structures locally is desirable. In addition, the electrical signal to construct and control the nanostructures can provide significant advantages toward the stability and ordering. Through experiments on the negative resistance switching phenomenon in Pt-NiO-Pt structures, we have fabricated nanofilament channels that can be electrically connected or disconnected. Various analyses indicate that the nanofilaments are made of nickel and are formed at the grain boundaries. The scaling behaviors of the nickel nanofilaments were closely examined, with respect to the switching time, power, and resistance. In particular, the 100 nm x 100 nm cell was switchable on the nanosecond scale, making them ideal for the basis for high-speed, high-density, nonvolatile memory applications.

Amorphous gallium indium zinc oxide thin film transistors: Sensitive to oxygen molecules

In this study, the authors report characteristic of indium gallium zinc oxides (GIZOs) which is strongly associated with the film surface. In ambient air, turn-on voltage of GIZO thin film transistors is approximately −7V. However, at the pressure of 8×10−6Torr, the turn-on voltage dramatically shifts to nearly −47V of the negative gate bias direction. When the oxygen is introduced in the chamber, the turn-on voltage returns to the normal value, that of air. It is believed that the adsorbed oxygen forms depletion layer below the surface, resulting in Von shifts. The carrier concentration of the channel varies from 1×1019to1×1020cm−3 due to oxygen adsorption.

2-stack 1D-1R Cross-point Structure with Oxide Diodes as Switch Elements for High Density Resistance RAM Applications

We have successfully integrated a 2-stack 8times8 array 1D- lR (one diode-one resistor) structure with 0.5 mumtimes0.5 mum cells in order to demonstrate the feasibility of high density stacked RRAM. p-CuOx/n-InZnOx heterojunction thin film was used for the first time as a oxide diode which shows increased current density of two orders over our previous p-NiOx/n-TiOx oxide diode. And Ti-doped NiO was used for the storage node. No limitation to the number of stacks has been observed from our results. Cell and device properties of our cross-point structure 8times8 array are reported. In addition, all fabrication processes were done at room temperature without other dedicated facilities or processes allowing for compatibility with current CMOS technology. Bi-stable switching for 1D-1R memory was demonstrated for our 2-stack cross-point structures showing excellent behavior for both diode and storage nodes. The forward current density for p-CuOx/n-IZOx diodes was over 104A/cm2, and the operation voltage for the storage node with diode attached was around 3 V.

Amorphous hafnium-indium-zinc oxide semiconductor thin film transistors

We developed amorphous hafnium-indium-zinc oxide (HIZO) thin films as oxide semiconductors and investigated the films electrically and physically. Adding of hafnium (Hf) element can suppress growing the columnar structure and drastically decrease the carrier concentration and hall mobility in HIZO films. The thin film transistors (TFTs) with amorphous HIZO active channel exhibit good electrical properties with field effect mobility of around 10 cm2/Vs, S of 0.23 V/decade, and high Ion/off ratio of over 108, enough to operate the next electronic devices. In particular, under bias-temperature stress test, the HIZO TFTs with 0.3 mol % (Hf content) showed only 0.46 V shift in threshold voltage, compared with 3.25 V shift in HIZO TFT (0.1 mol %). The Hf ions may play a key role to improve the instability of TFTs due to high oxygen bonding ability. Therefore, the amorphous HIZO semiconductor will be a prominent candidate as an operation device for large area electronic applications.

Enhanced light extraction efficiency of GaN-based light-emitting diodes with ZnO nanorod arrays grown using aqueous solution

We report a dramatic increase in the light extraction efficiency of GaN-based blue light-emitting diodes(LEDs) by ZnOnanorod arrays on a planar indium tin oxide (ITO) transparent electrode.ZnOnanorods were grown into aqueous solution at the low temperature of 90 ° C . With 20 mA current injection, the light output efficiency of the LED with ZnOnanorod arrays on ITO was increased by about 57% with no increase in a forward voltage over the conventional LEDs with planar ITO. The increased light extraction by the ZnOnanorod arrays is due to the formation of sidewalls and a rough surface, resulting in a multiple photon scattering at the LEDsurface.

Highly Stable Transparent Amorphous Oxide Semiconductor Thin‐Film Transistors Having Double‐Stacked Active Layers

Recently, amorphous oxide semiconductors (AOSs) have extensively been studied for applications as display devices because AOSs have many advantages over conventional amorphous and polycrystalline silicon that are used for the channel layers of thin-fi lm transistors (TFTs). [ 1 ] As a representative AOS material, amorphous gallium-indium-zinc-oxide (a-GIZO) has intensively been studied as an active layer of TFTs for switching/driving devices in active-matrix liquid crystal display (AMLCD) and active-matrix organic light-emitting diode display (AMOLED) backplanes [ 2–5 ] because of its advantages, such as a good short-range uniformity, a high fi eld-effect mobility ( μ FE ), a large area uniform integration, a low cost and low temperature fabrication process, transparency, etc. Therefore, AOSs can be used in novel application areas, including transparent and/ or fl exible electronic devices. Up until now, many prototype active-matrix displays have been demonstrated, including 12.1 inch wide extended graphics array (WXGA) OLED displays, [ 2 ]

Modeling of amorphous InGaZnO thin-film transistors based on the density of states extracted from the optical response of capacitance-voltage characteristics

In order to model dc characteristics of n-channel amorphous InGaZnO thin-film transistors from experimentally obtained density of states (DOS), the acceptorlike DOS is extracted from the optical response of capacitance-voltage characteristics and confirmed by the technology computer-aided design (TCAD) simulation comparing with the measured data. Extracted DOS is a linear superposition of two exponential functions (tail and deep states), and its incorporation into TCAD model reproduces well the experimental current-voltage characteristics over the wide range of the gate and drain voltages. The discrepancy at higher gate voltage is expected to be improved by incorporating a gate voltage-dependent mobility in the model.

Self-aligned top-gate amorphous gallium indium zinc oxide thin film transistors

We have demonstrated a self-aligned top-gate amorphous gallium indium zinc oxide thin film transistor (a-GIZO TFT). It had a field effect mobility of 5 cm2/V s, a threshold voltage of 0.2 V, and a subthreshold swing of 0.2 V/decade. Ar plasma was treated on the source/drain region of the a-GIZO active layer to reduce the series resistance. After Ar plasma treatment, the surface of the source/drain region was divided into In-rich and In-deficient regions. The a-GIZO TFT also had a constant sheet resistance of 1 kΩ/◻ for a film thickness of over 40 nm. The interface between the source/drain Mo metal and the Ar plasma-treated a-GIZO indicated a good Ohmic contact and a contact resistivity of 50 μΩ cm2.

Source/Drain Series-Resistance Effects in Amorphous Gallium–Indium Zinc-Oxide Thin Film Transistors

In this letter, we investigated the effects of source/drain series resistance on amorphous gallium-indium-doped zinc-oxide (a-GIZO) thin film transistors (TFTs). A linear least square fit of a plot of the reciprocal of channel resistance versus gate voltage yields a threshold voltage of 3.5 V and a field-effect mobility of about 13.5 cm2/Vldrs. Furthermore, in a-GIZO TFTs, most of the current flows in the distance range of 0-0.5 mum from the channel edge and shorter than that in a-Si:H TFTs. Moreover, unlike a-Si:H TFTs, a-GIZO TFTs did not show an intersection point, because they did not contain a highly doped ohmic (n+) layer below the source/drain electrodes.

Short Channel Characteristics of Gallium–Indium–Zinc–Oxide Thin Film Transistors for Three-Dimensional Stacking Memory

Amorphous gallium-indium-zinc-oxide (GIZO) thin film transistors with short channels of 50 nm were successfully fabricated by e-beam lithographic patterning. The GIZO thin film transistors showed a high mobility of 8.2 cm2/Vldrs with on-to-off current ratios up to 106. Excellent short channel characteristics were also obtained with a small shift of the threshold voltages and no degradation of subthreshold slopes as VDS increased, even with short channel lengths of less than 100 nm. These promising results indicate that the GIZO thin film transistors could be a candidate for selection transistors in 3-D cross point stacking memory.