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Young Wook Heo

Amkor Technology

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Publication

Featured researches published by Young Wook Heo.

Archive | 2003

Semiconductor package having stacked semiconductor chips and method of making the same

Young Wook Heo

Archive | 1997

Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same

Il Kwon Shim; Young Wook Heo; Robert Francis Darreaux

Archive | 1996

Ball grid array semiconductor package using a metal carrier ring as a heat spreader

Kwon Shim; Young Wook Heo

Archive | 1994

Mold runner removal from a substrate-based packaged electronic device

Bruce J. Freyman; John Briar; Young Wook Heo; Il Kwon Shim

Archive | 1996

Ball grid array semiconductor package with ring-type heat sink

Il Kwon Shim; Young Wook Heo

Archive | 1999

Method of forming chip bumps of bump chip scale semiconductor package

Young Wook Heo

Archive | 1997

Flexible circuit board for ball grid array semiconductor package

Il Kwon Shim; Young Wook Heo; Robert Darveaux

Archive | 2004

Stackable semiconductor package with solder on pads on which second semiconductor package is stacked

Akito Yoshida; Young Wook Heo

Archive | 1996

Ball grid array semiconductor package with improved heat dissipation and dehumidification effect

Il Kwon Shim; Young Wook Heo

Archive | 1996

Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same

Il Kwon Shim; Young Wook Heo

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Il Kwon Shim

Amkor Technology

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Akito Yoshida

Amkor Technology

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Bruce J. Freyman

Amkor Technology

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John Briar

Amkor Technology

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Byung Joon Han

Amkor Technology

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Kwon Shim

Amkor Technology

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Robert Darveaux

Amkor Technology

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Robert Francis Darreaux

Amkor Technology

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Sun Ho Ha

Amkor Technology

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