Young Wook Heo

Semiconductor package having stacked semiconductor chips and method of making the same

Ball grid array semiconductor package with solder balls fused on printed circuit board and method for fabricating the same

Ball grid array semiconductor package using a metal carrier ring as a heat spreader

Mold runner removal from a substrate-based packaged electronic device

Ball grid array semiconductor package with ring-type heat sink

Method of forming chip bumps of bump chip scale semiconductor package

Flexible circuit board for ball grid array semiconductor package

Stackable semiconductor package with solder on pads on which second semiconductor package is stacked

Ball grid array semiconductor package with improved heat dissipation and dehumidification effect

Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same