Yu-Hua Lee

Borderless dual damascene contact

Process to fabricate a cylindrical, capacitor structure under a bit line structure for a dynamic random access memory cell

Self-aligned contact process for a crown shaped dynamic random access memory capacitor structure

Method to form a recess free deep contact

Method to form capacitance node contacts with improved isolation in a DRAM process

Method to evaluate hemisperical grain (HSG) polysilicon surface

Method to eliminate shorts between adjacent contacts due to interlevel dielectric voids

Node process integration technology to improve data retention for logic based embedded dram

Method for making a double-cylinder-capacitor structure for dynamic random access memory (DRAM)

Process for forming a crown shaped capacitor structure for a DRAM device